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Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.

Programmable Logic Devices (PLD)

Available Parts 1,192

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XC9536XL-10VQG64C by Xilinx

XC9536XL-10VQG64C

Xilinx

XC9536XL-10VQG64C by Xilinx is a programmable logic device with 36 macro cells and 36 inputs/outputs. It operates at a max clock frequency of 138.88 MHz and has a propagation delay of 10 ns. This PLD is commonly used in applications requiring in-system programmability and high-speed data processing.

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP64,.47SQ

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Matte Tin

S-PQFP-G64

e3

Yes

No

XC9536XL-10VQG64I by Xilinx

XC9536XL-10VQG64I

Xilinx

The Xilinx XC9536XL-10VQG64I is a 36 macrocell FLASH PLD with 10 ns propagation delay, operating at a max clock frequency of 138.88 MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan testing for efficient development and debugging processes.

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP64,.47SQ

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Matte Tin

S-PQFP-G64

e3

Yes

No

XC9536XL-5CSG48C by Xilinx

XC9536XL-5CSG48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9536XL-5PCG44C by Xilinx

XC9536XL-5PCG44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

36

0

34

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

245 °C (473 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Matte Tin

S-PQCC-J44

e3

Yes

No

XC9536XL-5VQG64C by Xilinx

XC9536XL-5VQG64C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP64,.47SQ

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Matte Tin

S-PQFP-G64

e3

Yes

No

XC9536XL-7CSG48I by Xilinx

XC9536XL-7CSG48I

Xilinx

The Xilinx XC9536XL-7CSG48I is a 36 macrocell FLASH PLD with 7.5 ns propagation delay and 138.88 MHz max clock frequency. Ideal for industrial applications, it features in-system programmability, JTAG boundary scan test, and operates at temperatures ranging from -40 to 85°C.

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9536XL-7PCG44C by Xilinx

XC9536XL-7PCG44C

Xilinx

XC9536XL-7PCG44C by Xilinx is a 36 macrocell FLASH PLD with 7.5 ns propagation delay, in-system programmable, and operates at 3.3V. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

36

0

34

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

245 °C (473 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Matte Tin

S-PQCC-J44

e3

Yes

No

XC9536XL-7PCG44I by Xilinx

XC9536XL-7PCG44I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

36

0

34

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

245 °C (473 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Matte Tin

S-PQCC-J44

e3

Yes

No

XC9536XL-7VQG64C by Xilinx

XC9536XL-7VQG64C

Xilinx

Xilinx XC9536XL-7VQG64C is a 36 macrocell FLASH PLD with 7.5 ns propagation delay and 138.88 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its 36 I/O lines and JTAG boundary scan test capability.

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP64,.47SQ

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Matte Tin

S-PQFP-G64

e3

Yes

No

XC9536XL-7VQG64I by Xilinx

XC9536XL-7VQG64I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP64,.47SQ

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Matte Tin

S-PQFP-G64

e3

Yes

No

XC9572XL-10CSG48I by Xilinx

XC9572XL-10CSG48I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

100 MHz

10 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-10PCG44I by Xilinx

XC9572XL-10PCG44I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

100 MHz

10 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

245 °C (473 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Matte Tin

S-PQCC-J44

e3

Yes

No

XC9572XL-5CSG48C by Xilinx

XC9572XL-5CSG48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

178.6 MHz

5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-5PCG44C by Xilinx

XC9572XL-5PCG44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

178.6 MHz

5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

245 °C (473 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Matte Tin

S-PQCC-J44

e3

Yes

No

XC9572XL-7CSG48C by Xilinx

XC9572XL-7CSG48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-7CSG48I by Xilinx

XC9572XL-7CSG48I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-7PCG44C by Xilinx

XC9572XL-7PCG44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

245 °C (473 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Matte Tin

S-PQCC-J44

e3

Yes

No

XC9572XL-7PCG44I by Xilinx

XC9572XL-7PCG44I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

245 °C (473 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Matte Tin

S-PQCC-J44

e3

Yes

No

XCR3064XL-10CPG56C by Xilinx

XCR3064XL-10CPG56C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-10CPG56I by Xilinx

XCR3064XL-10CPG56I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-7CPG56I by Xilinx

XCR3064XL-7CPG56I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-6CPG56C by Xilinx

XCR3064XL-6CPG56C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

192 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-10CSG48I by Xilinx

XCR3064XL-10CSG48I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 40 I/O

Macrocell

64

0

40

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3064XL-7CSG48C by Xilinx

XCR3064XL-7CSG48C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 40 I/O

Macrocell

64

0

40

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3064XL-7CSG48I by Xilinx

XCR3064XL-7CSG48I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 40 I/O

Macrocell

64

0

40

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC95144XV-7CSG144C by Xilinx

XC95144XV-7CSG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

Macrocell

144

0

117

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3256XL-10CSG280I by Xilinx

XCR3256XL-10CSG280I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XCR3032XL-10CSG48C by Xilinx

XCR3032XL-10CSG48C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3032XL-10CSG48I by Xilinx

XCR3032XL-10CSG48I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3032XL-5CSG48C by Xilinx

XCR3032XL-5CSG48C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

213 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3032XL-7CSG48I by Xilinx

XCR3032XL-7CSG48I

Xilinx

Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3128XL-10CSG144C by Xilinx

XCR3128XL-10CSG144C

Xilinx

Xilinx XCR3128XL-10CSG144C is a 128 macrocell EE PLD with 10ns propagation delay, operating at 3.3V. Ideal for applications requiring in-system programmability and clock frequencies up to 95MHz. Features include JTAG boundary scan test, 108 I/O lines, and commercial-grade temperature rating.

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-10CSG144I by Xilinx

XCR3128XL-10CSG144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-7CSG144I by Xilinx

XCR3128XL-7CSG144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-6CSG144C by Xilinx

XCR3128XL-6CSG144C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

175 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-7CSG144C by Xilinx

XCR3128XL-7CSG144C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3384XL-10FTG256I by Xilinx

XCR3384XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3384XL-12FTG256C by Xilinx

XCR3384XL-12FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

83 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3384XL-7FTG256C by Xilinx

XCR3384XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-10FTG256I by Xilinx

XCR3512XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-12FTG256C by Xilinx

XCR3512XL-12FTG256C

Xilinx

Xilinx XCR3512XL-12FTG256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 77 MHz. It features in-system programmability and JTAG boundary scan test for versatile applications in commercial-grade electronics. The device has a low profile grid array package with 256 terminals, suitable for high-speed digital designs requiring fast propagation delay of 12 ns.

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-7FTG256C by Xilinx

XCR3512XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-12FTG256I by Xilinx

XCR3512XL-12FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FTG256C by Xilinx

XCR3256XL-10FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FTG256I by Xilinx

XCR3256XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-12FTG256C by Xilinx

XCR3256XL-12FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-12FTG256I by Xilinx

XCR3256XL-12FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-7FTG256C by Xilinx

XCR3256XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

154 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No