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Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.

Programmable Logic Devices (PLD)

Available Parts 1,192

Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
EPM7032BUC49-7 by Altera

EPM7032BUC49-7

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 49; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

303 MHz

3.5 ns

CMOS

Programmable Logic Devices

2.5

2.375 V

2.625 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA49,7X7,32

7 mm

7 mm

1.55 mm

Bottom

Ball

49

.8 mm

Tin Lead

S-PBGA-B49

e0

Yes

No

EPM7128AEUC169-10 by Altera

EPM7128AEUC169-10

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

98 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA169,13X13,32

11 mm

11 mm

1.55 mm

Bottom

Ball

169

.8 mm

Tin Lead

S-PBGA-B169

e0

Yes

No

EPM7128AEUC169-5 by Altera

EPM7128AEUC169-5

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

192.3 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA169,13X13,32

11 mm

11 mm

1.55 mm

Bottom

Ball

169

.8 mm

Tin Lead

S-PBGA-B169

e0

Yes

No

EPM7128AEUC169-7 by Altera

EPM7128AEUC169-7

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

129.9 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA169,13X13,32

11 mm

11 mm

1.55 mm

Bottom

Ball

169

.8 mm

Tin Lead

S-PBGA-B169

e0

Yes

No

EPM7128BUC169-10 by Altera

EPM7128BUC169-10

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

94.3 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.375 V

2.625 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA169,13X13,32

11 mm

11 mm

1.55 mm

Bottom

Ball

169

.8 mm

Tin Lead

S-PBGA-B169

e0

Yes

No

EPM7128BUC169-4 by Altera

EPM7128BUC169-4

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

243.9 MHz

4 ns

CMOS

Programmable Logic Devices

2.5

2.375 V

2.625 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA169,13X13,32

11 mm

11 mm

1.55 mm

Bottom

Ball

169

.8 mm

Tin Lead

S-PBGA-B169

e0

Yes

No

EPM7128BUC169-7 by Altera

EPM7128BUC169-7

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

126.6 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.375 V

2.625 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA169,13X13,32

11 mm

11 mm

1.55 mm

Bottom

Ball

169

.8 mm

Tin Lead

S-PBGA-B169

e0

Yes

No

EPM7128BUC49-10 by Altera

EPM7128BUC49-10

Altera

The Altera EPM7128BUC49-10 is a 128 macrocell EE PLD with 41 I/O lines, operating at up to 94.3 MHz clock frequency. It features a propagation delay of 10 ns and can be used for in-system programmable applications requiring low profile, fine pitch grid array packages.

EE PLD

Yes

0 Dedicated Inputs, 41 I/O

Macrocell

128

0

41

94.3 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.375 V

2.625 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA49,7X7,32

7 mm

7 mm

1.55 mm

Bottom

Ball

49

.8 mm

Tin Lead

S-PBGA-B49

e0

Yes

No

EPM7128BUC49-4 by Altera

EPM7128BUC49-4

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 49; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 41 I/O

Macrocell

128

0

41

243.9 MHz

4 ns

CMOS

Programmable Logic Devices

2.5

2.375 V

2.625 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA49,7X7,32

7 mm

7 mm

1.55 mm

Bottom

Ball

49

.8 mm

Tin Lead

S-PBGA-B49

e0

Yes

No

TIBPAL16R8-10MJB by Texas Instruments

TIBPAL16R8-10MJB

Texas Instruments

TIBPAL16R8-10MJB by Texas Instruments is a PAL-TYPE PLD with 10ns propagation delay, 5.5V max supply voltage, and 64 product terms. Ideal for MILITARY applications, it features 8 dedicated inputs, 8 outputs, and operates at up to 52.5MHz clock frequency.

OT PLD

No

8 Dedicated Inputs, 0 I/O

8

Registered

8

64

8

0

52.5 MHz

10 ns

TTL

PAL-TYPE

Programmable Logic Devices

5

4.5 V

5.5 V

5 V

125 °C (257 °F)

-55 °C (-67 °F)

Military

Ceramic, Glass-Sealed

In-Line

DIP

Rectangular

DIP20,.3

7.62 mm

24.195 mm

5.08 mm

Tube

Dual

Through-Hole

20

2.54 mm

Tin/Lead

R-GDIP-T20

e0

No

No

MIL-PRF-38535

TIBPAL16R8-10MWB by Texas Instruments

TIBPAL16R8-10MWB

Texas Instruments

TIBPAL16R8-10MWB by Texas Instruments is a 5V TTL PAL-TYPE PLD with 10ns propagation delay, 64 product terms, and 52.5MHz clock frequency. Ideal for military applications requiring MIL-PRF-38535 screening, it features 8 dedicated inputs and outputs in a ceramic flatpack package.

OT PLD

No

8 Dedicated Inputs, 0 I/O

8

Registered

8

64

8

0

52.5 MHz

10 ns

TTL

PAL-TYPE

Programmable Logic Devices

5

4.5 V

5.5 V

5 V

125 °C (257 °F)

-55 °C (-67 °F)

Military

Ceramic, Glass-Sealed

Flatpack

DFP

Rectangular

FL20,.3

6.92 mm

13.72 mm

2.45 mm

Tube

Dual

Flat

20

1.27 mm

Tin/Lead

R-GDFP-F20

e0

No

No

MIL-PRF-38535

EPM9560ARC304-10F by Altera

EPM9560ARC304-10F

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 304; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs

Macrocell

560

0

11.4 ns

CMOS

Programmable Logic Devices

5

4.75 V

5.25 V

3.3/5,5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

HQFP304,1.7SQ,20

40 mm

40 mm

4.5 mm

Quad

Gull Wing

304

.5 mm

Tin Lead

S-PQFP-G304

e0

Yes

No

ISPLSI5384VE-100LF256I by Lattice Semiconductor

ISPLSI5384VE-100LF256I

Lattice Semiconductor

ISPLSI5384VE-100LF256I by Lattice Semiconductor is a CMOS technology-based EE PLD with 384 macro cells. It offers a propagation delay of 12 ns, operates at a max clock frequency of 67 MHz, and has 192 I/O lines for versatile applications in industrial settings.

EE PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

384

0

192

67 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2.1 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC95288XL-10FG256C by Xilinx

XC95288XL-10FG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC95288XL-10FG256I by Xilinx

XC95288XL-10FG256I

Xilinx

XC95288XL-10FG256I by Xilinx is a 288 macrocell FLASH PLD with 192 I/O lines, operating at up to 100 MHz. It features a propagation delay of 10 ns and can handle a max supply voltage of 3.6 V. Ideal for industrial applications requiring high-speed programmable logic devices in a compact grid array package.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC95288XL-7FG256C by Xilinx

XC95288XL-7FG256C

Xilinx

XC95288XL-7FG256C by Xilinx is a 288 macro cell FLASH PLD with 192 inputs/outputs. It operates at 125 MHz, has a propagation delay of 7.5 ns, and supports JTAG boundary scan testing. Ideal for applications requiring high-speed processing and programmable logic functionality in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

TIBPAL16L8-20MFKB by Texas Instruments

TIBPAL16L8-20MFKB

Texas Instruments

TIBPAL16L8-20MFKB by Texas Instruments is a TTL technology PAL-type PLD with 20ns propagation delay, 64 product terms, and 40MHz max clock frequency. Ideal for military applications requiring combinatorial output functions in a ceramic chip carrier package.

OT PLD

No

10 Dedicated Inputs, 6 I/O

8

Combinatorial

16

64

10

6

40 MHz

20 ns

TTL

PAL-TYPE

Programmable Logic Devices

5

4.75 V

5.5 V

5 V

125 °C (257 °F)

-55 °C (-67 °F)

Military

Ceramic, Metal-Sealed Cofired

Chip Carrier

QCCN

Square

LCC20,.35SQ

8.89 mm

8.89 mm

2.03 mm

Tube

Quad

No Lead

20

1.27 mm

Tin Lead

S-CQCC-N20

e0

No

No

MIL-PRF-38535

TIBPAL16L8-20MJB by Texas Instruments

TIBPAL16L8-20MJB

Texas Instruments

TIBPAL16L8-20MJB by Texas Instruments is a PAL-TYPE PLD with 20ns propagation delay, 5.5V max supply voltage, and 40MHz clock frequency. Ideal for MILITARY applications requiring COMBINATORIAL output function in TTL technology with 10 dedicated inputs and 6 I/O lines.

OT PLD

No

10 Dedicated Inputs, 6 I/O

8

Combinatorial

16

64

10

6

40 MHz

20 ns

TTL

PAL-TYPE

Programmable Logic Devices

5

4.75 V

5.5 V

5 V

125 °C (257 °F)

-55 °C (-67 °F)

Military

Ceramic, Glass-Sealed

In-Line

DIP

Rectangular

DIP20,.3

6.92 mm

24.2 mm

5.08 mm

Tube

Dual

Through-Hole

20

2.54 mm

Tin Lead

R-GDIP-T20

e0

No

No

MIL-PRF-38535

TIBPAL16L8-20MWB by Texas Instruments

TIBPAL16L8-20MWB

Texas Instruments

TIBPAL16L8-20MWB by Texas Instruments is a 20 ns TTL PLD with 16 inputs, 64 product terms, and 8 outputs. It is used in MIL-grade applications for combinatorial output functions at up to 40 MHz clock frequency. The device comes in a ceramic package with flat terminals and operates b/w -55°C to 125°C temperature range.

OT PLD

No

10 Dedicated Inputs, 6 I/O

8

Combinatorial

16

64

10

6

40 MHz

20 ns

TTL

PAL-TYPE

Programmable Logic Devices

5

4.75 V

5.5 V

5 V

125 °C (257 °F)

-55 °C (-67 °F)

Military

Ceramic, Glass-Sealed

Flatpack

DFP

Rectangular

FL20,.3

6.92 mm

13.09 mm

2.45 mm

Tube

Dual

Flat

20

1.27 mm

Tin Lead

R-GDFP-F20

e0

No

No

MIL-PRF-38535

XC95288XV-10CS280C by Xilinx

XC95288XV-10CS280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B280

e0

Yes

No

XC95288XV-10FG256C by Xilinx

XC95288XV-10FG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B256

e0

Yes

No

XC95288XV-10FG256I by Xilinx

XC95288XV-10FG256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B256

e0

Yes

No

XC95288XV-10PQ208C by Xilinx

XC95288XV-10PQ208C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 168 I/O

Macrocell

288

0

168

100 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G208

e0

Yes

No

XC95288XV-10TQ144C by Xilinx

XC95288XV-10TQ144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

Macrocell

288

0

117

100 MHz

10 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP144,.87SQ,20

20 mm

20 mm

1.6 mm

Quad

Gull Wing

144

.5 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G144

e0

Yes

No

XC95288XV-7CS280C by Xilinx

XC95288XV-7CS280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B280

e0

Yes

No

XC95288XV-7FG256C by Xilinx

XC95288XV-7FG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B256

e0

Yes

No

XC95288XV-7PQ208C by Xilinx

XC95288XV-7PQ208C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 168 I/O

Macrocell

288

0

168

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G208

e0

Yes

No

XC95288XV-7TQ144C by Xilinx

XC95288XV-7TQ144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

Macrocell

288

0

117

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP144,.87SQ,20

20 mm

20 mm

1.6 mm

Quad

Gull Wing

144

.5 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G144

e0

Yes

No

XC9572XV-5CS48C by Xilinx

XC9572XV-5CS48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

Macrocell

72

0

38

222 MHz

5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B48

e0

Yes

No

XC9572XV-5PC44C by Xilinx

XC9572XV-5PC44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

222 MHz

5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.57 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XC9572XV-5TQ100C by Xilinx

XC9572XV-5TQ100C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 72 I/O

Macrocell

72

0

72

222 MHz

5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP100,.63SQ,20

14 mm

14 mm

1.6 mm

Quad

Gull Wing

100

.5 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G100

e0

Yes

No

XC9572XV-5VQ44C by Xilinx

XC9572XV-5VQ44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

222 MHz

5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

TQFP44,.47SQ,32

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G44

e0

Yes

No

XC9572XV-7CS48C by Xilinx

XC9572XV-7CS48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

Macrocell

72

0

38

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B48

e0

Yes

No

XC9572XV-7PC44C by Xilinx

XC9572XV-7PC44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.57 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XC9572XV-7TQ100C by Xilinx

XC9572XV-7TQ100C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 72 I/O

Macrocell

72

0

72

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP100,.63SQ,20

14 mm

14 mm

1.6 mm

Quad

Gull Wing

100

.5 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G100

e0

Yes

No

XC9572XV-7VQ44C by Xilinx

XC9572XV-7VQ44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

72

0

34

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

TQFP44,.47SQ,32

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G44

e0

Yes

No

XC95144XV-7TQ144I by Xilinx

XC95144XV-7TQ144I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

Macrocell

144

0

117

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP144,.87SQ,20

20 mm

20 mm

1.6 mm

Quad

Gull Wing

144

.5 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G144

e0

Yes

No

XC9536XV-5CS48C by Xilinx

XC9536XV-5CS48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

36

0

36

5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B48

e0

Yes

No

XC9536XV-5PC44C by Xilinx

XC9536XV-5PC44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

36

0

34

5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.57 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XC9536XV-5VQ44C by Xilinx

XC9536XV-5VQ44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

36

0

34

222.2 MHz

5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

TQFP44,.47SQ,32

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G44

e0

Yes

No

XC9536XV-7CS48C by Xilinx

XC9536XV-7CS48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

36

0

36

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B48

e0

Yes

No

XC9536XV-7PC44C by Xilinx

XC9536XV-7PC44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

36

0

34

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.57 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XC9536XV-7VQ44C by Xilinx

XC9536XV-7VQ44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

Macrocell

36

0

34

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

TQFP44,.47SQ,32

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Tin/Lead (Sn85Pb15)

S-PQFP-G44

e0

Yes

No

XCR3128XL-7CS144I by Xilinx

XCR3128XL-7CS144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XCR3128XL-7TQ144I by Xilinx

XCR3128XL-7TQ144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP144,.87SQ,20

20 mm

20 mm

1.6 mm

Quad

Gull Wing

144

.5 mm

Nickel Palladium Gold

S-PQFP-G144

e4

Yes

No

XCR3128XL-7VQ100I by Xilinx

XCR3128XL-7VQ100I

Xilinx

Xilinx XCR3128XL-7VQ100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock freq of 119 MHz, with propagation delay of 7.5 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.

EE PLD

Yes

0 Dedicated Inputs, 84 I/O

Macrocell

128

0

84

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP100,.63SQ

14 mm

14 mm

1.2 mm

Quad

Gull Wing

100

.5 mm

Tin Lead

S-PQFP-G100

e0

Yes

No

XCR3384XL-10FT256I by Xilinx

XCR3384XL-10FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3384XL-10PQ208C by Xilinx

XCR3384XL-10PQ208C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 172 I/O

Macrocell

384

0

172

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No