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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XCR3384XL-10PQ208I by Xilinx

XCR3384XL-10PQ208I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 172 I/O

Macrocell

384

0

172

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XCR3384XL-12FT256I by Xilinx

XCR3384XL-12FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

83 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3384XL-12PQ208I by Xilinx

XCR3384XL-12PQ208I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 172 I/O

Macrocell

384

0

172

83 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XCR3384XL-7FT256C by Xilinx

XCR3384XL-7FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3064XL-10PC44C by Xilinx

XCR3064XL-10PC44C

Xilinx

Xilinx XCR3064XL-10PC44C is a 64 macrocell EE PLD with 36 I/O lines. It operates at 3.3V, has a propagation delay of 10ns, and supports a max clock frequency of 95MHz. Ideal for applications requiring programmable logic devices in commercial temperature environments.

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

64

0

36

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XCR3064XL-10PC44I by Xilinx

XCR3064XL-10PC44I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

64

0

36

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XCR3064XL-6PC44C by Xilinx

XCR3064XL-6PC44C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

64

0

36

145 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XCR3064XL-7PC44C by Xilinx

XCR3064XL-7PC44C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

64

0

36

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XCR3064XL-7PC44I by Xilinx

XCR3064XL-7PC44I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

64

0

36

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Chip Carrier

QCCJ

Square

LDCC44,.7SQ

16.5862 mm

16.5862 mm

4.572 mm

Quad

J Bend

44

1.27 mm

Tin/Lead (Sn85Pb15)

S-PQCC-J44

e0

Yes

No

XCR3512XL-10FG324C by Xilinx

XCR3512XL-10FG324C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XCR3512XL-10FG324I by Xilinx

XCR3512XL-10FG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XCR3512XL-10FT256C by Xilinx

XCR3512XL-10FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-10FT256I by Xilinx

XCR3512XL-10FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-10PQ208C by Xilinx

XCR3512XL-10PQ208C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 180 I/O

Macrocell

512

0

180

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XCR3512XL-10PQ208I by Xilinx

XCR3512XL-10PQ208I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 180 I/O

180

Macrocell

184

512

0

180

81.3 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XCR3512XL-12PQ208C by Xilinx

XCR3512XL-12PQ208C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 180 I/O

Macrocell

512

0

180

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XCR3512XL-7FT256C by Xilinx

XCR3512XL-7FT256C

Xilinx

Xilinx XCR3512XL-7FT256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 135 MHz. It features in-system programmability and JTAG boundary scan testing, suitable for applications requiring fast propagation delay of 7.5 ns and low profile grid array packaging.

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-7PQ208C by Xilinx

XCR3512XL-7PQ208C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 180 I/O

Macrocell

512

0

180

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XA9536XL-15VQG44I by Xilinx

XA9536XL-15VQG44I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

Flash PLD

0 Dedicated Inputs, 34 I/O

Macrocell

0

34

15.5 ns

CMOS

3.3

3 V

3.6 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Matte Tin

S-PQFP-G44

e3

No

XA9536XL-15VQG44Q by Xilinx

XA9536XL-15VQG44Q

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

Flash PLD

0 Dedicated Inputs, 34 I/O

Macrocell

0

34

15.5 ns

CMOS

3.3

3 V

3.6 V

105 °C (221 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Matte Tin

S-PQFP-G44

e3

No

AEC-Q100; TS 16949

XA9572XL-15TQG100I by Xilinx

XA9572XL-15TQG100I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

0 Dedicated Inputs, 72 I/O

Macrocell

0

72

15.5 ns

CMOS

3.3

3 V

3.6 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

Quad

Gull Wing

100

.5 mm

Matte Tin

S-PQFP-G100

e3

No

XA9572XL-15TQG100Q by Xilinx

XA9572XL-15TQG100Q

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

0 Dedicated Inputs, 72 I/O

Macrocell

0

72

15.5 ns

CMOS

3.3

3 V

3.6 V

105 °C (221 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

Quad

Gull Wing

100

.5 mm

Matte Tin

S-PQFP-G100

e3

No

XA9572XL-15VQG44I by Xilinx

XA9572XL-15VQG44I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

Flash PLD

0 Dedicated Inputs, 34 I/O

Macrocell

0

34

15.5 ns

CMOS

3.3

3 V

3.6 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Matte Tin

S-PQFP-G44

e3

No

XA9572XL-15VQG44Q by Xilinx

XA9572XL-15VQG44Q

Xilinx

XA9572XL-15VQG44Q by Xilinx is a 3.3V FLASH PLD with 34 I/O lines, 15.5 ns propagation delay, and -40 to 105°C operating temperature range. Ideal for industrial applications requiring programmable logic devices in a compact square package with gull wing terminals.

Flash PLD

0 Dedicated Inputs, 34 I/O

Macrocell

0

34

15.5 ns

CMOS

3.3

3 V

3.6 V

105 °C (221 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Matte Tin

S-PQFP-G44

e3

No

AEC-Q100; TS 16949

XA9572XL-15VQG64I by Xilinx

XA9572XL-15VQG64I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

Flash PLD

0 Dedicated Inputs, 52 I/O

Macrocell

0

52

15.5 ns

CMOS

3.3

3 V

3.6 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Matte Tin

S-PQFP-G64

e3

No

XA9572XL-15VQG64Q by Xilinx

XA9572XL-15VQG64Q

Xilinx

XA9572XL-15VQG64Q by Xilinx is a 3.3V CMOS FLASH PLD with 52 I/O lines, 15.5 ns propagation delay, and -40 to 105 °C operating temp. Ideal for industrial applications requiring fast processing speed and high I/O capacity in a compact square package with gull wing terminals.

Flash PLD

0 Dedicated Inputs, 52 I/O

Macrocell

0

52

15.5 ns

CMOS

3.3

3 V

3.6 V

105 °C (221 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Matte Tin

S-PQFP-G64

e3

No

XA95144XL-15CSG144I by Xilinx

XA95144XL-15CSG144I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

0 Dedicated Inputs, 117 I/O

Macrocell

0

117

15.5 ns

CMOS

3.3

3 V

3.6 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

No

XC2C512-7FT256I by Xilinx

XC2C512-7FT256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-7FTG256I by Xilinx

XC2C512-7FTG256I

Xilinx

XC2C512-7FTG256I by Xilinx is a 512 macrocell FLASH PLD with 212 I/O lines, operating at 119 MHz. It has a propagation delay of 7.5 ns and can handle a max supply voltage of 1.9 V. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FT256I by Xilinx

XCR3256XL-10FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3256XL-12FT256C by Xilinx

XCR3256XL-12FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3256XL-12FT256I by Xilinx

XCR3256XL-12FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3256XL-7FT256C by Xilinx

XCR3256XL-7FT256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

154 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3384XL-10FG324I by Xilinx

XCR3384XL-10FG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 220 I/O

Macrocell

384

0

220

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B324

e0

Yes

No

XC9536XL-7CS48I by Xilinx

XC9536XL-7CS48I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Lead

S-PBGA-B48

e0

Yes

No

XC9536XL-7VQ44I by Xilinx

XC9536XL-7VQ44I

Xilinx

Xilinx XC9536XL-7VQ44I is a 36 macrocell FLASH PLD with 34 I/O lines. It operates at 138.88 MHz clock frequency, has 7.5 ns propagation delay, and supports JTAG boundary scan test. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.

Flash PLD

Yes

0 Dedicated Inputs, 34 I/O

34

Macrocell

34

36

0

34

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Thin Profile

TQFP

Square

TQFP44,.47SQ,32

10 mm

10 mm

1.2 mm

Quad

Gull Wing

44

.8 mm

Nickel Palladium Gold

S-PQFP-G44

e4

Yes

No

XC9536XL-7VQ64I by Xilinx

XC9536XL-7VQ64I

Xilinx

The Xilinx XC9536XL-7VQ64I is a 36 macrocell FLASH PLD with 7.5 ns propagation delay and 138.88 MHz max clock frequency. Ideal for industrial applications, it features in-system programmability, 36 I/O lines, and JTAG boundary scan test capability.

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP64,.47SQ

10 mm

10 mm

1.2 mm

Quad

Gull Wing

64

.5 mm

Tin Lead

S-PQFP-G64

e0

Yes

No

XCR3384XL-10TQ144I by Xilinx

XCR3384XL-10TQ144I

Xilinx

Xilinx XCR3384XL-10TQ144I is a 384 macrocell EE PLD with 118 I/O lines, operating at up to 102 MHz. It features a propagation delay of 10 ns and supports in-system programmability. Ideal for industrial applications requiring high-speed data processing and flexible logic configurations.

EE PLD

Yes

0 Dedicated Inputs, 118 I/O

Macrocell

384

0

118

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP144,.87SQ,20

20 mm

20 mm

1.6 mm

Quad

Gull Wing

144

.5 mm

Nickel Palladium Gold

S-PQFP-G144

e4

Yes

No

XCR3384XL-12TQ144I by Xilinx

XCR3384XL-12TQ144I

Xilinx

Xilinx XCR3384XL-12TQ144I is a 384 macrocell EE PLD with 118 I/O lines. It operates at max clock freq of 83 MHz, with propagation delay of 12 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.

EE PLD

Yes

0 Dedicated Inputs, 118 I/O

Macrocell

384

0

118

83 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP144,.87SQ,20

20 mm

20 mm

1.6 mm

Quad

Gull Wing

144

.5 mm

Nickel Palladium Gold

S-PQFP-G144

e4

Yes

No

XCR3512XL-12FG324I by Xilinx

XCR3512XL-12FG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XCR3512XL-12FT256I by Xilinx

XCR3512XL-12FT256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XCR3512XL-12PQ208I by Xilinx

XCR3512XL-12PQ208I

Xilinx

Xilinx XCR3512XL-12PQ208I is a 512 macrocell EE PLD with 184 inputs and 180 I/O lines. It operates at max clock frequency of 67.56 MHz, suitable for industrial applications requiring in-system programmability and JTAG boundary scan testing.

EE PLD

Yes

0 Dedicated Inputs, 180 I/O

180

Macrocell

184

512

0

180

67.56 MHz

12 ns

CMOS

PLA-TYPE

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XC2C256-6FT256C by Xilinx

XC2C256-6FT256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C256-6PQ208C by Xilinx

XC2C256-6PQ208C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 173 I/O

173

Macrocell

173

256

0

173

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Flatpack, Fine Pitch

FQFP

Square

QFP208,1.2SQ,20

28 mm

28 mm

4.1 mm

Quad

Gull Wing

208

.5 mm

Nickel Palladium Gold

S-PQFP-G208

e4

Yes

No

XC2C256-6TQ144C by Xilinx

XC2C256-6TQ144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 118 I/O

118

Macrocell

118

256

0

118

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

QFP144,.87SQ,20

20 mm

20 mm

1.6 mm

Quad

Gull Wing

144

.5 mm

Nickel Palladium Gold

S-PQFP-G144

e4

Yes

No

XC2C256-6VQ100C by Xilinx

XC2C256-6VQ100C

Xilinx

XC2C256-6VQ100C by Xilinx is a programmable logic device (PLD) with 256 macro cells and 80 inputs/outputs. It operates on a supply voltage range of 1.7V to 1.9V and has a max clock frequency of 139 MHz. This PLD is commonly used for in-system programmable applications requiring high-speed processing capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 80 I/O

80

Macrocell

80

256

0

80

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

3

Plastic/Epoxy

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

TQFP100,.63SQ

14 mm

14 mm

1.2 mm

Quad

Gull Wing

100

.5 mm

Nickel Palladium Gold

S-PQFP-G100

e4

Yes

No

XC95288XL-7BG256I by Xilinx

XC95288XL-7BG256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC95288XL-7CS280I by Xilinx

XC95288XL-7CS280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No