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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
EP2A15B724C9 by Altera

EP2A15B724C9

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

492 I/O

480

Macrocell

480

16640

492

2.23 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A25B724C8 by Altera

EP2A25B724C8

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

536 I/O

524

Macrocell

524

24320

536

1.94 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A40B724C7 by Altera

EP2A40B724C7

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

536 I/O

524

Macrocell

524

38400

536

1.55 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A40B724C8 by Altera

EP2A40B724C8

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

536 I/O

524

Macrocell

524

38400

536

1.78 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A40B724C9 by Altera

EP2A40B724C9

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

536 I/O

524

Macrocell

524

38400

536

2.05 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A70B724C7 by Altera

EP2A70B724C7

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

536 I/O

524

Macrocell

524

67200

536

2.17 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A70B724C8 by Altera

EP2A70B724C8

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

536 I/O

524

Macrocell

524

67200

536

2.49 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A70B724C9 by Altera

EP2A70B724C9

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

536 I/O

524

Macrocell

524

67200

536

2.87 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

Plastic/Epoxy

Grid Array

BGA

Square

BGA724,27X27,50

35 mm

35 mm

3.5 mm

Bottom

Ball

724

1.27 mm

Tin Lead

S-PBGA-B724

e0

No

EP2A70F1508C7 by Altera

EP2A70F1508C7

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1508; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

1060 I/O

1048

Macrocell

1048

67200

1060

2.17 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA1508,39X39,40

40 mm

40 mm

3.5 mm

Bottom

Ball

1508

1 mm

Tin Lead

S-PBGA-B1508

e0

No

EP2A70F1508C8 by Altera

EP2A70F1508C8

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1508; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

1060 I/O

1048

Macrocell

1048

67200

1060

2.49 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA1508,39X39,40

40 mm

40 mm

3.5 mm

Bottom

Ball

1508

1 mm

Tin Lead

S-PBGA-B1508

e0

No

EP2A70F1508C9 by Altera

EP2A70F1508C9

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1508; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

1060 I/O

1048

Macrocell

1048

67200

1060

2.87 ns

CMOS

Field Programmable Gate Arrays

1.5

1.425 V

1.575 V

1.5,1.5/3.3 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA1508,39X39,40

40 mm

40 mm

3.5 mm

Bottom

Ball

1508

1 mm

Tin Lead

S-PBGA-B1508

e0

No

XCR3512XL-12FG324I by Xilinx

XCR3512XL-12FG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

EPXA1F484C1 by Altera

EPXA1F484C1

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 186 I/O

Macrocell

0

186

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Lead

S-PBGA-B484

e0

No

EPXA1F484C2 by Altera

EPXA1F484C2

Altera

EPXA1F484C2 by Altera is a 484-terminal PLD with 186 I/O lines. It operates b/w 0-85°C, with a supply voltage range of 1.71-1.89V. Ideal for applications requiring loadable PLDs and macrocell outputs in a square grid array package.

Loadable PLD

0 Dedicated Inputs, 186 I/O

Macrocell

0

186

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Lead

S-PBGA-B484

e0

No

EPXA1F484C3 by Altera

EPXA1F484C3

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 186 I/O

Macrocell

0

186

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Lead

S-PBGA-B484

e0

No

EPXA1F672C1 by Altera

EPXA1F672C1

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 246 I/O

Macrocell

0

246

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

2.1 mm

Bottom

Ball

672

1 mm

Tin Lead

S-PBGA-B672

e0

No

EPXA1F672C2 by Altera

EPXA1F672C2

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 246 I/O

Macrocell

0

246

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

2.1 mm

Bottom

Ball

672

1 mm

Tin Lead

S-PBGA-B672

e0

No

EPXA1F672C3 by Altera

EPXA1F672C3

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 246 I/O

Macrocell

0

246

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

2.1 mm

Bottom

Ball

672

1 mm

Tin Lead

S-PBGA-B672

e0

No

XC95288XL-7BG256I by Xilinx

XC95288XL-7BG256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC95288XL-7FG256I by Xilinx

XC95288XL-7FG256I

Xilinx

The Xilinx XC95288XL-7FG256I is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and 125 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing. Features include a propagation delay of 7.5 ns, operating temperature range of -40 to 85°C, and a compact square package design.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC95288XV-6FG256C by Xilinx

XC95288XV-6FG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

208 MHz

6 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B256

e0

Yes

No

XC2C512-10FG324C by Xilinx

XC2C512-10FG324C

Xilinx

Xilinx XC2C512-10FG324C is a 512 macrocell FLASH PLD with 270 I/O lines, operating at max 91 MHz clock frequency. It has a propagation delay of 10 ns and can handle supply voltages from 1.7V to 1.9V. Ideal for applications requiring high-speed programmable logic in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-10FG324I by Xilinx

XC2C512-10FG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-7FG324C by Xilinx

XC2C512-7FG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C384-10FG324I by Xilinx

XC2C384-10FG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

LC5256MV-75FN256C by Lattice Semiconductor

LC5256MV-75FN256C

Lattice Semiconductor

LC5256MV-75FN256C by Lattice Semiconductor is a 256 macrocell EE PLD with 9.5 ns propagation delay, in-system programmable, and 141 I/O lines. It uses CMOS technology, has a max supply voltage of 3.6 V, and is suitable for applications requiring programmable logic devices in a square grid array package.

EE PLD

Yes

0 Dedicated Inputs, 141 I/O

Macrocell

256

0

141

9.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

250 °C (482 °F)

3

40 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2.1 mm

Bottom

Ball

256

1 mm

Tin/Silver/Copper

S-PBGA-B256

e1

Yes

No

EP20K200FC484-1XV by Altera

EP20K200FC484-1XV

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 382 I/O

Macrocell

4

382

2.5 ns

2.5

2.375 V

2.625 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Silver Copper

S-PBGA-B484

e1

No

XC2C384-10FGG324C by Xilinx

XC2C384-10FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C384-10FGG324I by Xilinx

XC2C384-10FGG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-10FGG324C by Xilinx

XC2C512-10FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-10FGG324I by Xilinx

XC2C512-10FGG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-7FGG324C by Xilinx

XC2C512-7FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC95288XL-10BGG256C by Xilinx

XC95288XL-10BGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-10BGG256I by Xilinx

XC95288XL-10BGG256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-10FGG256C by Xilinx

XC95288XL-10FGG256C

Xilinx

The Xilinx XC95288XL-10FGG256C is a 288 macrocell FLASH PLD with 192 inputs/outputs, operating at up to 100 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and flexibility in programmable logic design.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-10FGG256I by Xilinx

XC95288XL-10FGG256I

Xilinx

The Xilinx XC95288XL-10FGG256I is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and 100 MHz clock frequency. It is ideal for industrial applications requiring in-system programmability, JTAG boundary scan testing, and a wide operating temperature range from -40 to 85°C.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-6BGG256C by Xilinx

XC95288XL-6BGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

208.3 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-6FGG256C by Xilinx

XC95288XL-6FGG256C

Xilinx

The Xilinx XC95288XL-6FGG256C is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and a max clock frequency of 208.3 MHz. It is ideal for applications requiring fast propagation delay of 6 ns, such as high-speed digital signal processing and communication systems. The device features in-system programmability and JTAG boundary scan test capabilities for efficient development and testing processes.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

208.3 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7BGG256C by Xilinx

XC95288XL-7BGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7BGG256I by Xilinx

XC95288XL-7BGG256I

Xilinx

XC95288XL-7BGG256I by Xilinx is a 288 macrocell FLASH PLD with 192 inputs/outputs, operating at 125 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7FGG256C by Xilinx

XC95288XL-7FGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7FGG256I by Xilinx

XC95288XL-7FGG256I

Xilinx

The Xilinx XC95288XL-7FGG256I is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and a max clock frequency of 125 MHz. It is ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing. The device operates at temperatures ranging from -40 to 85°C, making it suitable for various industrial environments.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-10FGG324I by Xilinx

XCR3512XL-10FGG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

EPM3128AFC256-10 by Altera

EPM3128AFC256-10

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 98 I/O

Macrocell

128

0

98

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

3.5 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

EPM3128AFC256-5 by Altera

EPM3128AFC256-5

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 98 I/O

Macrocell

128

0

98

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

3.5 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

EPM3128AFC256-7 by Altera

EPM3128AFC256-7

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 98 I/O

Macrocell

128

0

98

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

3.5 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

EP20K200CF484C-7N by Altera

EP20K200CF484C-7N

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 376 I/O

Macrocell

4

376

1.48 ns

2.5

2.375 V

2.625 V

85 °C (185 °F)

0 °C (32 °F)

Other

245 °C (473 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Silver Copper

S-PBGA-B484

e1

No

EP20K600CB672C8 by Altera

EP20K600CB672C8

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 508 I/O

Macrocell

4

508

1.78 ns

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

3.5 mm

Bottom

Ball

672

1 mm

S-PBGA-B672

No