Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XC95288XV-7FG256C
Xilinx
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Flash PLD
Yes
0 Dedicated Inputs, 192 I/O
Macrocell
288
0
192
125 MHz
7.5 ns
CMOS
Programmable Logic Devices
2.5
2.37 V
2.62 V
1.8/3.3,2.5 V
70 °C (158 °F)
0 °C (32 °F)
Commercial
225 °C (437 °F)
3
30 s
Plastic/Epoxy
Grid Array
BGA
Square
BGA256,16X16,40
17 mm
2 mm
Bottom
Ball
256
1 mm
Tin/Lead (Sn63Pb37)
S-PBGA-B256
e0
No
XC95288XV-7PQ208C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
0 Dedicated Inputs, 168 I/O
168
Flatpack, Fine Pitch
FQFP
QFP208,1.2SQ,20
28 mm
4.1 mm
Quad
Gull Wing
208
.5 mm
Tin/Lead (Sn85Pb15)
S-PQFP-G208
XC95288XV-7TQ144C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
0 Dedicated Inputs, 117 I/O
117
Flatpack, Low Profile, Fine Pitch
LFQFP
QFP144,.87SQ,20
20 mm
1.6 mm
144
S-PQFP-G144
XC9572XV-5CS48C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;
0 Dedicated Inputs, 38 I/O
72
38
222 MHz
5 ns
240 °C (464 °F)
Grid Array, Fine Pitch
FBGA
BGA48,7X7,32
7 mm
1.8 mm
48
.8 mm
S-PBGA-B48
XC9572XV-5PC44C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
0 Dedicated Inputs, 34 I/O
34
Chip Carrier
QCCJ
LDCC44,.7SQ
16.5862 mm
4.57 mm
J Bend
44
1.27 mm
S-PQCC-J44
XC9572XV-5TQ100C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
0 Dedicated Inputs, 72 I/O
QFP100,.63SQ,20
14 mm
100
S-PQFP-G100
XC9572XV-5VQ44C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
Flatpack, Thin Profile
TQFP
TQFP44,.47SQ,32
10 mm
1.2 mm
S-PQFP-G44
XC9572XV-7CS48C
XC9572XV-7PC44C
XC9572XV-7TQ100C
XC9572XV-7VQ44C
XC95144XV-7TQ144I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
85 °C (185 °F)
-40 °C (-40 °F)
Industrial
XC9536XV-5CS48C
0 Dedicated Inputs, 36 I/O
36
XC9536XV-5PC44C
XC9536XV-5VQ44C
222.2 MHz
XC9536XV-7CS48C
XC9536XV-7PC44C
XC9536XV-7VQ44C
XCR3128XL-7CS144I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
EE PLD
0 Dedicated Inputs, 108 I/O
128
108
119 MHz
3.3
2.7 V
3.6 V
3/3.3 V
Grid Array, Thin Profile, Fine Pitch
TFBGA
BGA144,13X13,32
12 mm
Tin Lead
S-PBGA-B144
XCR3128XL-7TQ144I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
Nickel Palladium Gold
e4
XCR3128XL-7VQ100I
Xilinx XCR3128XL-7VQ100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock freq of 119 MHz, with propagation delay of 7.5 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
0 Dedicated Inputs, 84 I/O
84
Flatpack, Thin Profile, Fine Pitch
TFQFP
TQFP100,.63SQ
XCR3384XL-10FT256I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
0 Dedicated Inputs, 212 I/O
384
212
102 MHz
10 ns
Grid Array, Low Profile
LBGA
1.55 mm
XCR3384XL-10PQ208C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
0 Dedicated Inputs, 172 I/O
172
3 V
3.3 V
XCR3384XL-10PQ208I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XCR3384XL-12FT256I
83 MHz
12 ns
XCR3384XL-12PQ208I
XCR3384XL-7FT256C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
135 MHz
EP20K400BC652-2XV
Altera
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 652; Package Code: BGA; Package Shape: SQUARE;
Loadable PLD
4 Dedicated Inputs, 502 I/O
4
502
3.1 ns
2.375 V
2.625 V
Other
220 °C (428 °F)
45 mm
3.5 mm
652
Tin Silver Copper
S-PBGA-B652
e1
XCR3064XL-10PC44C
Xilinx XCR3064XL-10PC44C is a 64 macrocell EE PLD with 36 I/O lines. It operates at 3.3V, has a propagation delay of 10ns, and supports a max clock frequency of 95MHz. Ideal for applications requiring programmable logic devices in commercial temperature environments.
64
95 MHz
4.572 mm
XCR3064XL-10PC44I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
XCR3064XL-6PC44C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
145 MHz
6 ns
XCR3064XL-7PC44C
XCR3064XL-7PC44I
ATF1502ASV-20AC44
Atmel
Atmel ATF1502ASV-20AC44 is a 32 macrocell EE PLD with 20ns propagation delay, operating at max 3.6V. It's a CMOS technology-based programmable logic device in a square package for applications requiring high-speed processing up to 83.3MHz, suitable for commercial temperature environments.
0 Dedicated Inputs, 32 I/O
32
83.3 MHz
20 ns
QFP44,.47SQ,32
ATF1504ASV-15AC100
Atmel ATF1504ASV-15AC100 is a 64 macrocell EE PLD with 15ns propagation delay, operating at max 100MHz clock frequency. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial temperature environments. Features include in-system programmability, JTAG boundary scan test, and thin profile flatpack package style.
0 Dedicated Inputs, 64 I/O
100 MHz
15 ns
2.5/3.3,3.3 V
CY39100V256B-83BBC
Cypress Semiconductor
CY39100V256B-83BBC by Cypress Semiconductor is a 1536 macrocell LOADABLE PLD with 15ns propagation delay. It operates at 2.5V, has 180 I/O lines, and supports JTAG boundary scan testing. Ideal for applications requiring fast processing speeds and extensive input/output capabilities in commercial-grade environments.
0 Dedicated Inputs, 180 I/O
1536
180
Also operates at 3.3 V nominal supply
2.3 V
1.5/3.3,2.5/3.3 V
CY39100V388B-125MGC
CY39100V388B-125MGC by Cypress: 10ns Propagation Delay, 1536 Macro Cells, CMOS tech. Ideal for PLD applications with 294 I/O lines, JTAG Boundary Scan Test, and In-System Programmable feature.
0 Dedicated Inputs, 294 I/O
294
BGA388,26X26,50
35 mm
2.46 mm
388
S-PBGA-B388
XCR3512XL-10FG324C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
0 Dedicated Inputs, 260 I/O
512
260
97 MHz
BGA324,20X20,40
23 mm
2.5 mm
324
S-PBGA-B324
XCR3512XL-10FG324I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
XCR3512XL-10FT256C
XCR3512XL-10FT256I
XCR3512XL-10PQ208C
XCR3512XL-10PQ208I
184
81.3 MHz
PLA-TYPE
XCR3512XL-12PQ208C
77 MHz
XCR3512XL-7FT256C
Xilinx XCR3512XL-7FT256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 135 MHz. It features in-system programmability and JTAG boundary scan testing, suitable for applications requiring fast propagation delay of 7.5 ns and low profile grid array packaging.
XCR3512XL-7PQ208C
EPM7064BUC49-7
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 49; Package Code: LFBGA; Package Shape: SQUARE;
0 Dedicated Inputs, 41 I/O
41
303 MHz
3.5 ns
Grid Array, Low Profile, Fine Pitch
LFBGA
BGA49,7X7,32
49
S-PBGA-B49
M4A3-256/128-10YNI
Lattice Semiconductor
M4A3-256/128-10YNI by Lattice Semiconductor is a 256 macrocell EE PLD with 128 I/O lines. It operates at a max clock frequency of 62.5 MHz and has a propagation delay of 10 ns, making it suitable for industrial applications requiring high-speed processing and programmable logic capabilities. With in-system programmability and JTAG boundary scan test support, this PLD offers flexibility and ease of integration in various electronic systems.
14 Dedicated Inputs, 128 I/O
14
62.5 MHz
245 °C (473 °F)
40 s
Matte Tin
e3
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