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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4VFX20-11FF672C by Xilinx

XC4VFX20-11FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX20-11FF672I by Xilinx

XC4VFX20-11FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

19224

320

320

2136

1181 MHz

CMOS

Field Programmable Gate Arrays

2136 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX40-10FF1152I by Xilinx

XC4VFX40-10FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 448;

FPGA

41904

448

448

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX40-10FF672C by Xilinx

XC4VFX40-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX40-10FF672I by Xilinx

XC4VFX40-10FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

41904

352

352

4656

1028 MHz

CMOS

Field Programmable Gate Arrays

4656 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-10FF1152C by Xilinx

XC4VFX60-10FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-10FF1152I by Xilinx

XC4VFX60-10FF1152I

Xilinx

Xilinx XC4VFX60-10FF1152I FPGA features 56880 logic cells, 6320 CLBs, and a max clock frequency of 1028 MHz. Ideal for high-performance applications requiring fast processing speeds in a compact form factor. Suitable for various industries like telecommunications, aerospace, and automotive due to its advanced CMOS technology and programmable nature.

FPGA

56880

576

576

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-10FF672C by Xilinx

XC4VFX60-10FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-10FF672I by Xilinx

XC4VFX60-10FF672I

Xilinx

XC4VFX60-10FF672I by Xilinx is a FPGA with 56880 logic cells, 6320 CLBs, and 352 inputs/outputs. It operates at max frequency of 1028 MHz and supports industrial temperature range. Ideal for high-performance applications requiring fast processing speeds in compact designs.

FPGA

56880

352

352

6320

1028 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-11FF1152C by Xilinx

XC4VFX60-11FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

576

576

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-11FF1152I by Xilinx

XC4VFX60-11FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;

FPGA

56880

576

576

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin Lead

1 mm

1152

S-PBGA-B1152

e0

No

XC4VFX60-11FF672C by Xilinx

XC4VFX60-11FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

56880

352

352

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VFX60-11FF672I by Xilinx

XC4VFX60-11FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 56880;

FPGA

56880

352

352

6320

1181 MHz

CMOS

Field Programmable Gate Arrays

6320 CLBS

1.2

1.14 V

1.26 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA672,26X26,40

Bottom

Ball

Tin Lead

1 mm

672

S-PBGA-B672

e0

No

XC4VLX100-10FF1148C by Xilinx

XC4VLX100-10FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

768

768

12288

1028 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX100-10FF1148I by Xilinx

XC4VLX100-10FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 768;

FPGA

110592

768

768

12288

1028 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX100-10FF1513C by Xilinx

XC4VLX100-10FF1513C

Xilinx

XC4VLX100-10FF1513C by Xilinx is a FPGA with 110592 logic cells, 12288 CLBs, and 960 inputs/outputs. Operating at up to 1028 MHz, it's ideal for high-speed applications like telecommunications and signal processing due to its advanced CMOS technology.

FPGA

110592

960

960

12288

1028 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX100-10FF1513I by Xilinx

XC4VLX100-10FF1513I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

110592

960

960

12288

1028 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX100-11FF1148C by Xilinx

XC4VLX100-11FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

768

768

12288

1205 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX100-11FF1148I by Xilinx

XC4VLX100-11FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

110592

768

768

12288

1205 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX100-11FF1513I by Xilinx

XC4VLX100-11FF1513I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FPGA

110592

960

960

12288

1205 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX100-12FF1148C by Xilinx

XC4VLX100-12FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

768

768

12288

1205 MHz

CMOS

Field Programmable Gate Arrays

12288 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX15-10SF363C by Xilinx

XC4VLX15-10SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-10SF363I by Xilinx

XC4VLX15-10SF363I

Xilinx

Xilinx XC4VLX15-10SF363I FPGA features 13824 logic cells, 1536 CLBs, and a max clock frequency of 1028 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities in a compact form factor.

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-11SF363I by Xilinx

XC4VLX15-11SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;

FPGA

13824

240

240

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX160-10FF1148C by Xilinx

XC4VLX160-10FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

152064

768

768

16896

1028 MHz

CMOS

Field Programmable Gate Arrays

16896 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX160-10FF1148I by Xilinx

XC4VLX160-10FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

152064

768

768

16896

1028 MHz

CMOS

Field Programmable Gate Arrays

16896 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX160-10FF1513C by Xilinx

XC4VLX160-10FF1513C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE;

FPGA

152064

960

960

16896

1028 MHz

CMOS

Field Programmable Gate Arrays

16896 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX160-10FF1513I by Xilinx

XC4VLX160-10FF1513I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

152064

960

960

16896

1028 MHz

CMOS

Field Programmable Gate Arrays

16896 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX160-11FF1148C by Xilinx

XC4VLX160-11FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

152064

768

768

16896

1205 MHz

CMOS

Field Programmable Gate Arrays

16896 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX160-11FF1148I by Xilinx

XC4VLX160-11FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FPGA

152064

768

768

16896

1205 MHz

CMOS

Field Programmable Gate Arrays

16896 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX160-11FF1513I by Xilinx

XC4VLX160-11FF1513I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

152064

960

960

16896

1205 MHz

CMOS

Field Programmable Gate Arrays

16896 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX200-10FF1513I by Xilinx

XC4VLX200-10FF1513I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1513; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;

FPGA

200448

960

960

22272

1028 MHz

CMOS

Field Programmable Gate Arrays

22272 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX200-11FF1513C by Xilinx

XC4VLX200-11FF1513C

Xilinx

The Xilinx XC4VLX200-11FF1513C is a FPGA with 200448 logic cells, 22272 CLBs, and max clock frequency of 1205 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

200448

960

960

22272

1205 MHz

CMOS

Field Programmable Gate Arrays

22272 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.25 mm

BGA1513,39X39,40

Bottom

Ball

Tin Lead

1 mm

1513

S-PBGA-B1513

e0

No

XC4VLX25-10SF363C by Xilinx

XC4VLX25-10SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-10SF363I by Xilinx

XC4VLX25-10SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-11SF363C by Xilinx

XC4VLX25-11SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-11SF363I by Xilinx

XC4VLX25-11SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-12SF363C by Xilinx

XC4VLX25-12SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX40-10FF1148C by Xilinx

XC4VLX40-10FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

41472

640

640

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX40-10FF1148I by Xilinx

XC4VLX40-10FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 640;

FPGA

41472

640

640

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX40-10FF668C by Xilinx

XC4VLX40-10FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

41472

448

448

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX40-10FF668I by Xilinx

XC4VLX40-10FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 448;

FPGA

41472

448

448

4608

1028 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX40-11FF1148I by Xilinx

XC4VLX40-11FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; Organization: 4608 CLBS;

FPGA

41472

640

640

4608

1205 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX40-11FF668I by Xilinx

XC4VLX40-11FF668I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

41472

448

448

4608

1205 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX40-12FF668C by Xilinx

XC4VLX40-12FF668C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 668; Package Code: BGA; Package Shape: SQUARE;

FPGA

41472

448

448

4608

1205 MHz

CMOS

Field Programmable Gate Arrays

4608 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No

XC4VLX60-10FF1148C by Xilinx

XC4VLX60-10FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

59904

640

640

6656

1028 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX60-10FF1148I by Xilinx

XC4VLX60-10FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

59904

640

640

6656

1028 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin Lead

1 mm

1148

S-PBGA-B1148

e0

No

XC4VLX60-10FF668C by Xilinx

XC4VLX60-10FF668C

Xilinx

XC4VLX60-10FF668C by Xilinx is a FPGA with 59904 logic cells, 6656 CLBs, and 448 inputs/outputs. Operating at up to 1028 MHz, it's ideal for high-speed applications like telecommunications equipment and industrial automation systems. With a package style of grid array and CMOS technology, it offers flexibility in design while maintaining reliability.

FPGA

59904

448

448

6656

1028 MHz

CMOS

Field Programmable Gate Arrays

6656 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.85 mm

BGA668,26X26,40

Bottom

Ball

Tin Lead

1 mm

668

S-PBGA-B668

e0

No