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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3164-3PC84C by Xilinx

XC3164-3PC84C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;

FPGA

224

70

70

224

4000

270 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

224 CLBS, 4000 Gates

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Chip Carrier

QCCJ

Square

29.3116 mm

29.3116 mm

4.699 mm

LDCC84,1.2SQ

Quad

J Bend

Tin Lead

1.27 mm

84

S-PQCC-J84

e0

No

XC3164-3PP132C by Xilinx

XC3164-3PP132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 132; Package Code: PGA; Package Shape: SQUARE;

FPGA

224

110

110

224

4000

270 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

224 CLBS, 4000 Gates

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

1

Plastic/Epoxy

No

Grid Array

PGA

Square

37.084 mm

37.084 mm

3.7338 mm

PGA132,14X14

Perpendicular

Pin/Peg

2.54 mm

132

S-PPGA-P132

No

XC3164-4PP132C by Xilinx

XC3164-4PP132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 132; Package Code: PGA; Package Shape: SQUARE;

FPGA

224

110

110

224

4000

230 MHz

3.3 ns

CMOS

Field Programmable Gate Arrays

224 CLBS, 4000 Gates

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

1

Plastic/Epoxy

No

Grid Array

PGA

Square

37.084 mm

37.084 mm

3.7338 mm

PGA132,14X14

Perpendicular

Pin/Peg

Tin Lead

2.54 mm

132

S-PPGA-P132

e0

No

XC3195-3PG223C by Xilinx

XC3195-3PG223C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 223; Package Code: PGA; Package Shape: SQUARE;

FPGA

484

176

176

484

6500

270 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

484 CLBS, 6500 Gates

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

1

Ceramic, Metal-Sealed Cofired

No

Grid Array

PGA

Square

47.244 mm

47.244 mm

4.064 mm

PGA223,18X18

Perpendicular

Pin/Peg

2.54 mm

223

S-CPGA-P223

No

XC3195-5PG223C by Xilinx

XC3195-5PG223C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 223; Package Code: PGA; Package Shape: SQUARE;

FPGA

484

176

176

484

6500

190 MHz

4.1 ns

CMOS

Field Programmable Gate Arrays

484 CLBS, 6500 Gates

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

1

Ceramic, Metal-Sealed Cofired

No

Grid Array

PGA

Square

47.244 mm

47.244 mm

4.064 mm

PGA223,18X18

Perpendicular

Pin/Peg

2.54 mm

223

S-CPGA-P223

No

XC3064L-8TQ144I by Xilinx

XC3064L-8TQ144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

224

120

120

224

3500

80 MHz

6.7 ns

CMOS

Field Programmable Gate Arrays

224 CLBS, 3500 Gates

Max usable 4500 Logic gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

144

S-PQFP-G144

e0

No

XCV405E-6BG560C by Xilinx

XCV405E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-6FG676C by Xilinx

XCV405E-6FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-7BG560C by Xilinx

XCV405E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV405E-7FG676C by Xilinx

XCV405E-7FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-8FG676C by Xilinx

XCV405E-8FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV812E-6BG560C by Xilinx

XCV812E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV812E-7BG560C by Xilinx

XCV812E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV812E-8BG560C by Xilinx

XCV812E-8BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

404

404

4704

254016

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 254016 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

OR4E02-1BA352C by Lattice Semiconductor

OR4E02-1BA352C

Lattice Semiconductor

OR4E02-1BA352C by Lattice Semiconductor is a FPGA with 4992 logic cells, 624 CLBs, and 201000 gates. It operates at a max frequency of 420 MHz and has 262 inputs/outputs. Ideal for applications requiring high-speed processing in commercial environments.

FPGA

4992

262

262

624

201000

420 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

624 CLBS, 201000 Gates

Maximum no of usable gates is 397000

1.5

1.425 V

1.575 V

1.5/3.3 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.54 mm

BGA352,26X26,50

Bottom

Ball

1.27 mm

352

S-PBGA-B352

No