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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XA3S1600E-4FGG484I by Xilinx

XA3S1600E-4FGG484I

Xilinx

XA3S1600E-4FGG484I by Xilinx is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 gates. Operating at 572 MHz, it's ideal for industrial applications requiring high-speed processing and low power consumption. With a max supply voltage of 1.26V and operating temperature range from -40 to 85°C, it offers reliable performance in various environments.

FPGA

33192

376

294

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3S200-4TQG144I by Xilinx

XA3S200-4TQG144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

4320

173

173

480

200000

125 MHz

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XA3S250E-4PQG208I by Xilinx

XA3S250E-4PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

5508

158

126

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XA3S400-4FGG456I by Xilinx

XA3S400-4FGG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

264

264

896

400000

125 MHz

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

456

S-PBGA-B456

e1

No

AEC-Q100

XA3S500E-4PQG208I by Xilinx

XA3S500E-4PQG208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

10476

158

126

1164

500000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

AEC-Q100

XC4VLX25-10FFG676C by Xilinx

XC4VLX25-10FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC4VLX25-10FFG676I by Xilinx

XC4VLX25-10FFG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.14 V;

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC4VLX25-11FFG676I by Xilinx

XC4VLX25-11FFG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC4VLX25-12FFG676C by Xilinx

XC4VLX25-12FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX110-3FFG1153C by Xilinx

XC5VLX110-3FFG1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.67 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX110-3FFG676C by Xilinx

XC5VLX110-3FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

440

440

8640

0.67 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX110T-3FFG1136C by Xilinx

XC5VLX110T-3FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

640

640

8640

0.67 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VLX30-3FF324C by Xilinx

XC5VLX30-3FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX30-3FFG324C by Xilinx

XC5VLX30-3FFG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX30-3FFG676C by Xilinx

XC5VLX30-3FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30T-3FFG665C by Xilinx

XC5VLX30T-3FFG665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

360

360

2400

1412 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX50-3FF324C by Xilinx

XC5VLX50-3FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX50-3FF676C by Xilinx

XC5VLX50-3FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX50-3FFG1153C by Xilinx

XC5VLX50-3FFG1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

560

560

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX50T-3FFG1136C by Xilinx

XC5VLX50T-3FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

480

480

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

10.5 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VLX85-3FFG1153C by Xilinx

XC5VLX85-3FFG1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

560

560

6480

0.67 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX85-3FFG676C by Xilinx

XC5VLX85-3FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

440

440

6480

0.67 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX85T-3FF1136C by Xilinx

XC5VLX85T-3FF1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

480

480

6480

0.67 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX35T-3FFG665C by Xilinx

XC5VSX35T-3FFG665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

34816

360

360

2720

0.67 ns

CMOS

Field Programmable Gate Arrays

2720 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VSX50T-3FFG665C by Xilinx

XC5VSX50T-3FFG665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

360

360

4080

0.67 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VSX95T-3FF1136C by Xilinx

XC5VSX95T-3FF1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

94208

640

640

7360

550 MHz

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX95T-3FFG1136C by Xilinx

XC5VSX95T-3FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

94208

640

640

7360

1205 MHz

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC3SD1800A-4CS484LI by Xilinx

XC3SD1800A-4CS484LI

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 1800000;

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD1800A-4CSG484LI by Xilinx

XC3SD1800A-4CSG484LI

Xilinx

Xilinx XC3SD1800A-4CSG484LI FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-4CS484LI by Xilinx

XC3SD3400A-4CS484LI

Xilinx

The Xilinx XC3SD3400A-4CS484LI is a FPGA with 53712 logic cells, 5968 CLBs, and 3400000 equivalent gates. It operates at a max frequency of 250 MHz and has 309 inputs and 249 outputs. Ideal for applications requiring high-speed processing in industries like telecommunications and aerospace.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD3400A-4CSG484LI by Xilinx

XC3SD3400A-4CSG484LI

Xilinx

The Xilinx XC3SD3400A-4CSG484LI is a FPGA with 53712 logic cells, 5968 CLBs, and 3400000 equivalent gates. It operates at a max frequency of 250 MHz and has 309 inputs and 249 outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XA3S1000-4FTG256Q by Xilinx

XA3S1000-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

125 MHz

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

TQFP100,.63SQ

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S1500-4FGG676I by Xilinx

XA3S1500-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

487

487

3328

1500000

125 MHz

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XA3S200-4TQG144Q by Xilinx

XA3S200-4TQG144Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

4320

173

173

480

200000

125 MHz

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

XC6VHX250T-1FF1154I by Xilinx

XC6VHX250T-1FF1154I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VHX250T-1FFG1154C by Xilinx

XC6VHX250T-1FFG1154C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX250T-2FFG1154C by Xilinx

XC6VHX250T-2FFG1154C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX250T-2FFG1154I by Xilinx

XC6VHX250T-2FFG1154I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX255T-2FFG1923C by Xilinx

XC6VHX255T-2FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

253440

480

480

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-1FFG1923C by Xilinx

XC6VHX380T-1FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-1FFG1924C by Xilinx

XC6VHX380T-1FFG1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

640

640

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1924

S-PBGA-B1924

e1

No

XC6VHX380T-2FFG1154C by Xilinx

XC6VHX380T-2FFG1154C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX380T-2FFG1154I by Xilinx

XC6VHX380T-2FFG1154I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX380T-2FFG1155C by Xilinx

XC6VHX380T-2FFG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

440

440

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1155,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1155

S-PBGA-B1155

e1

No

XC6VHX380T-2FFG1923C by Xilinx

XC6VHX380T-2FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-2FFG1923I by Xilinx

XC6VHX380T-2FFG1923I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-2FFG1924I by Xilinx

XC6VHX380T-2FFG1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

640

640

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1924

S-PBGA-B1924

e1

No

XC6VLX130T-1FF1156C by Xilinx

XC6VLX130T-1FF1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No