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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCV1000E-7FG860C by Xilinx

XCV1000E-7FG860C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

660

660

6144

331776

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No

XCV1600E-7FG860C by Xilinx

XCV1600E-7FG860C

Xilinx

Xilinx XCV1600E-7FG860C is a FPGA with 34992 logic cells, 7776 CLBs, and 419904 gates. It operates at a max frequency of 400 MHz and has 660 inputs/outputs. Ideal for applications requiring high-speed processing in compact designs.

FPGA

34992

660

660

7776

419904

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No

XCV2000E-6FG860I by Xilinx

XCV2000E-6FG860I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

43200

660

660

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No

XCV2000E-7FG860C by Xilinx

XCV2000E-7FG860C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE;

FPGA

43200

660

660

9600

518400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No