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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2V1000-4BG575I by Xilinx

XC2V1000-4BG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.5;

FPGA

11520

328

328

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Lead

1.27 mm

575

S-PBGA-B575

e0

No

XC2V1000-5BG575I by Xilinx

XC2V1000-5BG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 1000000;

FPGA

11520

328

328

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Lead

1.27 mm

575

S-PBGA-B575

e0

No

XC2V1500-4BG575I by Xilinx

XC2V1500-4BG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Lead

1.27 mm

575

S-PBGA-B575

e0

No

XC2V1500-5BG575I by Xilinx

XC2V1500-5BG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Organization: 1920 CLBS, 1500000 GATES;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Lead

1.27 mm

575

S-PBGA-B575

e0

No

XC2V2000-4BG575I by Xilinx

XC2V2000-4BG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA575,24X24,50;

FPGA

24192

408

408

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Lead

1.27 mm

575

S-PBGA-B575

e0

No

XC2V2000-5BG575I by Xilinx

XC2V2000-5BG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

24192

408

408

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Lead

1.27 mm

575

S-PBGA-B575

e0

No

XC2V1000-4BGG575C by Xilinx

XC2V1000-4BGG575C

Xilinx

XC2V1000-4BGG575C by Xilinx is a FPGA with 11520 logic cells, 1280 CLBs, and 1000000 equivalent gates. It operates at max frequency of 650 MHz, suitable for applications requiring high-speed processing like telecommunications and signal processing. With a max supply voltage of 1.575 V, it offers versatile programmability in a compact grid array package.

FPGA

11520

328

328

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-4BGG575I by Xilinx

XC2V1000-4BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 328;

FPGA

11520

328

328

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-5BGG575C by Xilinx

XC2V1000-5BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

328

328

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-5BGG575I by Xilinx

XC2V1000-5BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

11520

328

328

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1000-6BGG575C by Xilinx

XC2V1000-6BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

328

328

1280

1000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-4BGG575C by Xilinx

XC2V1500-4BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-4BGG575I by Xilinx

XC2V1500-4BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.6 mm;

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-5BGG575C by Xilinx

XC2V1500-5BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-5BGG575I by Xilinx

XC2V1500-5BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V1500-6BGG575C by Xilinx

XC2V1500-6BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-4BGG575C by Xilinx

XC2V2000-4BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

408

408

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-4BGG575I by Xilinx

XC2V2000-4BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

24192

408

408

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-5BGG575C by Xilinx

XC2V2000-5BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

408

408

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-5BGG575I by Xilinx

XC2V2000-5BGG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 2688;

FPGA

24192

408

408

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No

XC2V2000-6BGG575C by Xilinx

XC2V2000-6BGG575C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

408

408

2688

2000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Silver Copper

1.27 mm

575

S-PBGA-B575

e1

No