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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4VFX12-10SF363I by Xilinx

XC4VFX12-10SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

12312

240

240

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-10SF363C by Xilinx

XC4VLX15-10SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-10SF363I by Xilinx

XC4VLX15-10SF363I

Xilinx

Xilinx XC4VLX15-10SF363I FPGA features 13824 logic cells, 1536 CLBs, and a max clock frequency of 1028 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities in a compact form factor.

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-11SF363I by Xilinx

XC4VLX15-11SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;

FPGA

13824

240

240

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-10SF363C by Xilinx

XC4VLX25-10SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-10SF363I by Xilinx

XC4VLX25-10SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-11SF363C by Xilinx

XC4VLX25-11SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-11SF363I by Xilinx

XC4VLX25-11SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-12SF363C by Xilinx

XC4VLX25-12SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VFX12-10SFG363C by Xilinx

XC4VFX12-10SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

12312

240

240

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VFX12-10SFG363I by Xilinx

XC4VFX12-10SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Organization: 1368 CLBS;

FPGA

12312

240

240

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VFX12-11SFG363C by Xilinx

XC4VFX12-11SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

12312

240

240

1368

1181 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX15-10SFG363C by Xilinx

XC4VLX15-10SFG363C

Xilinx

The Xilinx XC4VLX15-10SFG363C is a FPGA with 13824 logic cells, 1536 CLBs, and max clock frequency of 1028 MHz. It operates at a supply voltage range of 1.14V to 1.26V and is ideal for applications requiring high-speed processing and programmable IC solutions in various industries.

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX15-10SFG363I by Xilinx

XC4VLX15-10SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX15-11SFG363C by Xilinx

XC4VLX15-11SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

13824

240

240

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX15-11SFG363I by Xilinx

XC4VLX15-11SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

FPGA

13824

240

240

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-10SFG363C by Xilinx

XC4VLX25-10SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-10SFG363I by Xilinx

XC4VLX25-10SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-11SFG363C by Xilinx

XC4VLX25-11SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-11SFG363I by Xilinx

XC4VLX25-11SFG363I

Xilinx

XC4VLX25-11SFG363I by Xilinx is a FPGA with 24192 logic cells, 2688 CLBs, and 240 inputs/outputs. It operates at a max frequency of 1205 MHz and uses CMOS technology. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-12SFG363C by Xilinx

XC4VLX25-12SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No