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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCS30XL-4CS280C by Xilinx

XCS30XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS30XL-5CS280C by Xilinx

XCS30XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-4CS280C by Xilinx

XCS40XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-5CS280C by Xilinx

XCS40XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No