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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCVU440-1FLGB2377C by Xilinx

XCVU440-1FLGB2377C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1

XCVU440-2FLGB2377E by Xilinx

XCVU440-2FLGB2377E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1

XCVU440-2FLGB2377I by Xilinx

XCVU440-2FLGB2377I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1