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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6VHX255T-2FFG1923C by Xilinx

XC6VHX255T-2FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

253440

480

480

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-1FFG1923C by Xilinx

XC6VHX380T-1FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-2FFG1923C by Xilinx

XC6VHX380T-2FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-2FFG1923I by Xilinx

XC6VHX380T-2FFG1923I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No