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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2VP100-5FF1704I by Xilinx

XC2VP100-5FF1704I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FPGA

99216

1040

1040

11024

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

11024 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP100-6FF1704C by Xilinx

XC2VP100-6FF1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

99216

1040

1040

11024

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

11024 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP100-6FF1704I by Xilinx

XC2VP100-6FF1704I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .32 ns;

FPGA

99216

1040

1040

11024

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

11024 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-5FF1704C by Xilinx

XC2VP70-5FF1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-5FF1704I by Xilinx

XC2VP70-5FF1704I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 996;

FPGA

74448

996

996

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-6FF1704C by Xilinx

XC2VP70-6FF1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-6FF1704I by Xilinx

XC2VP70-6FF1704I

Xilinx

Xilinx XC2VP70-6FF1704I FPGA features 74448 logic cells, 8272 CLBs, and 996 inputs/outputs. Utilized in applications requiring high clock frequencies up to 1200 MHz, such as telecommunications and signal processing due to its advanced CMOS technology. Package style is a grid array with a square shape and ball terminals for surface mounting.

FPGA

74448

996

996

8272

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-7FF1704C by Xilinx

XC2VP70-7FF1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP100-6FFG1704I by Xilinx

XC2VP100-6FFG1704I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.5;

FPGA

99216

1040

1040

11024

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

11024 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1704

S-PBGA-B1704

e1

No

XC2VP70-5FFG1704C by Xilinx

XC2VP70-5FFG1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1704

S-PBGA-B1704

e1

No

XC2VP70-5FFG1704I by Xilinx

XC2VP70-5FFG1704I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;

FPGA

74448

996

996

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1704

S-PBGA-B1704

e1

No

XC2VP70-7FFG1704C by Xilinx

XC2VP70-7FFG1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1704

S-PBGA-B1704

e1

No