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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7VX415T-1FFG1158I by Xilinx

XC7VX415T-1FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

412160

350

350

32200

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX415T-2FFG1158C by Xilinx

XC7VX415T-2FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

412160

350

350

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX415T-2FFG1158I by Xilinx

XC7VX415T-2FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

412160

350

350

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-1FFG1158C by Xilinx

XC7VX485T-1FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

350

350

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-1FFG1158I by Xilinx

XC7VX485T-1FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.35 mm;

FPGA

485760

350

350

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-2FFG1158C by Xilinx

XC7VX485T-2FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

350

350

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-2FFG1158I by Xilinx

XC7VX485T-2FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1158;

FPGA

485760

350

350

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-3FFG1158E by Xilinx

XC7VX485T-3FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

485760

350

350

37950

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX550T-1FFG1158C by Xilinx

XC7VX550T-1FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

554240

350

350

43300

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX550T-2FFG1158C by Xilinx

XC7VX550T-2FFG1158C

Xilinx

Xilinx XC7VX550T-2FFG1158C FPGA features 554240 logic cells, 43300 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with low combinatorial delay.

FPGA

554240

350

350

43300

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX550T-2FFG1158I by Xilinx

XC7VX550T-2FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

554240

350

350

43300

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

43300 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-1FFG1158C by Xilinx

XC7VX690T-1FFG1158C

Xilinx

Xilinx XC7VX690T-1FFG1158C FPGA features 693120 logic cells, 54150 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a wide range of inputs and outputs.

FPGA

693120

350

350

54150

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-2FFG1158C by Xilinx

XC7VX690T-2FFG1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

693120

350

350

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-2FFG1158I by Xilinx

XC7VX690T-2FFG1158I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

693120

350

350

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-3FFG1158E by Xilinx

XC7VX690T-3FFG1158E

Xilinx

The Xilinx XC7VX690T-3FFG1158E is a FPGA with 693120 logic cells, 54150 CLBs, and max clock frequency of 1818 MHz. It is used in high-performance applications requiring advanced programmable ICs for complex digital designs.

FPGA

693120

350

350

54150

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX485T-L2FFG1158E by Xilinx

XC7VX485T-L2FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Organization: 37950 CLBS;

FPGA

485760

350

350

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-L2FFG1158E by Xilinx

XC7VX690T-L2FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

693120

350

350

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX415T-2FFV1158C by Xilinx

XC7VX415T-2FFV1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

32200

0.61 ns

32200 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1