Loading...
Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7V585T-1FFG1157C by Xilinx

XC7V585T-1FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

582720

600

600

45525

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

45525 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7V585T-1FFG1157I by Xilinx

XC7V585T-1FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

582720

600

600

45525

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

45525 CLBS

1

.97 V

1.03 V

1,1.8 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7V585T-2FFG1157I by Xilinx

XC7V585T-2FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

582720

600

600

45525

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

45525 CLBS

1

.97 V

1.03 V

1,1.8 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-1FFG1157C by Xilinx

XC7VX485T-1FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

600

600

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-1FFG1157I by Xilinx

XC7VX485T-1FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1157;

FPGA

485760

600

600

37950

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-2FFG1157C by Xilinx

XC7VX485T-2FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

600

600

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-2FFG1157I by Xilinx

XC7VX485T-2FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

485760

600

600

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-3FFG1157E by Xilinx

XC7VX485T-3FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

485760

600

600

37950

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-1FFG1157C by Xilinx

XC7VX330T-1FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

326400

600

600

25500

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-1FFG1157I by Xilinx

XC7VX330T-1FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1818 MHz;

FPGA

326400

600

600

25500

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-2FFG1157C by Xilinx

XC7VX330T-2FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

326400

600

600

25500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-2FFG1157I by Xilinx

XC7VX330T-2FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

326400

600

600

25500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX330T-3FFG1157E by Xilinx

XC7VX330T-3FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

326400

600

600

25500

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

25500 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX415T-1FFG1157I by Xilinx

XC7VX415T-1FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.8;

FPGA

412160

600

600

32200

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX415T-2FFG1157C by Xilinx

XC7VX415T-2FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

412160

600

600

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX415T-2FFG1157I by Xilinx

XC7VX415T-2FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

412160

600

600

32200

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX415T-3FFG1157E by Xilinx

XC7VX415T-3FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

412160

600

600

32200

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

32200 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX690T-1FFG1157C by Xilinx

XC7VX690T-1FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

693120

600

600

54150

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX690T-1FFG1157I by Xilinx

XC7VX690T-1FFG1157I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

693120

600

600

54150

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX690T-2FFG1157C by Xilinx

XC7VX690T-2FFG1157C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE;

FPGA

693120

600

600

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX690T-2FFG1157I by Xilinx

XC7VX690T-2FFG1157I

Xilinx

Xilinx XC7VX690T-2FFG1157I FPGA features 693120 logic cells, 54150 CLBs, and 600 inputs/outputs. Utilized in high-performance applications like telecommunications and aerospace due to its max clock frequency of 1818 MHz and operating temperature range from -40°C to 100°C.

FPGA

693120

600

600

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX690T-3FFG1157E by Xilinx

XC7VX690T-3FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Organization: 54150 CLBS;

FPGA

693120

600

600

54150

1818 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-L2FFG1157E by Xilinx

XC7VX485T-L2FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

485760

600

600

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No