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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6VHX380T-3FFG1155C by Xilinx

XC6VHX380T-3FFG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

382464

440

440

1412 MHz

CMOS

Field Programmable Gate Arrays

1,1.2/2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1155,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1155

S-PBGA-B1155

e1

No

XC7VH580T-1FLG1155C by Xilinx

XC7VH580T-1FLG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.74 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH580T-2FLG1155C by Xilinx

XC7VH580T-2FLG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH580T-G2FLG1155E by Xilinx

XC7VH580T-G2FLG1155E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC6VHX380T-2FFG1155C by Xilinx

XC6VHX380T-2FFG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

440

440

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1155,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1155

S-PBGA-B1155

e1

No