Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.
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AGIB027R31B3E3E
Intel
Intel's AGIB027R31B3E3E is a SoC FPGA with 3184 terminals, operating from 0 to 100°C. Its plastic/epoxy body and rectangular shape make it suitable for surface mount applications. Ideal for various functions in uPs, uCs, and peripheral ICs.
R-PBGA-B3184
3184
100 Cel
0 Cel
PLASTIC/EPOXY
RECTANGULAR
YES
BALL
BOTTOM
SoC FPGA
AGFA027R24C2E3E
Intel AGFA027R24C2E3E is a SoC FPGA with 2340 terminals, operating from 0°C to 100°C. Its plastic/epoxy body and rectangular shape make it suitable for surface mount applications. Ideal for various functions in uPs, uCs & peripheral ICs due to its high terminal count and robust design.
R-PBGA-B2340
2340
MIMXRT105SCVL5B
NXP Semiconductors
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE; Width: 10 mm;
S-PBGA-B196
10 mm
196
105 Cel
-40 Cel
LFBGA
BGA196,14X14,32
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
1.52 mm
1.26 V
1.15 V
CMOS
.65 mm
SYSTEM ON CHIP
ESP32-WROOM-32E(M113EH3200PH3Q0)
Espressif Systems (Shanghai)
ESP32-WROOM-32E(M113EH3200PH3Q0) by Espressif Systems is a MICROPROCESSOR CIRCUIT with 38 terminals, operating at 3-3.6V. It has an industrial temperature grade of -40 to 85°C and is ideal for IoT applications requiring low power consumption and wireless connectivity.
R-XXMA-N38
25.5 mm
38
85 Cel
UNSPECIFIED
XMA
MICROELECTRONIC ASSEMBLY
3.25 mm
3.6 V
3 V
3.3 V
INDUSTRIAL
NO LEAD
1.27 mm
18 mm
MICROPROCESSOR CIRCUIT
PN7150B0HN/C11006E
PN7150B0HN/C11006E by NXP Semiconductors is a NFC controller with a supply voltage range of 1.65V to 1.95V and operating temperature range of -30°C to 85°C. It comes in a square package with 40 terminals and is suitable for applications requiring contactless communication.
S-XQCC-N40
6 mm
3
40
-30 Cel
HVQCCN
LCC40,.24SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
1 mm
1.95 V
1.65 V
1.8 V
.5 mm
QUAD
NFC CONTROLLER
SLS32AIA020X4USON10XTMA4
Infineon Technologies
CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: HVSON; Package Shape: SQUARE;
S-PDSO-N10
3 mm
10
-25 Cel
HVSON
SOLCC10,.12,20
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.6 mm
5.5 V
1.62 V
5 V
OTHER
DUAL
CRYPTOGRAPHIC AUTHENTICATOR
SLS32AIA010MLUSON10XTMA2
SLS32AIA010MLUSON10XTMA2 by Infineon Technologies is a cryptographic authenticator IC with 10 terminals, CMOS technology, and 3.3V nominal voltage. It operates in industrial temperature range (-40 to 105 °C) and has a small outline package style suitable for surface mount applications.
NRF52832-QFAB-T
Nordic Semiconductor Asa
NRF52832-QFAB-T by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable ICs in compact designs.
S-XQCC-N48
48
LCC48,.24SQ,16
.9 mm
1.7 V
.4 mm
SoC
ATMXT640UD-CCU001
Microchip Technology
Microchip Technology's ATMXT640UD-CCU001 is a 3.3V capacitive touch screen controller with 88 terminals in a square package style. Operating temperature ranges from -40 to 85 °C, suitable for various applications requiring precise touch input control. Its ultra-thin profile and fine pitch make it ideal for compact electronic devices.
S-PBGA-B88
88
VFBGA
BGA88,10X10,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
3.47 V
3.14 V
CAPACITIVE TOUCH SCREEN CONTROLLERS
MIMXRT1051CVJ5BR
The NXP Semiconductors MIMXRT1051CVJ5BR is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring a low profile, fine pitch package style and grid array configuration.
12 mm
.8 mm
ESP32-C3FN4
ESP32-C3FN4 by Espressif Systems (shanghai) Operates at 3.6V, -40 to 85°C temp range, CMOS tech. Ideal for microprocessor circuits in IoT devices due to its small size (5x5mm), low power consumption, and quad terminal position.
ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY
S-PQCC-N32
5 mm
32
LCC32,.2SQ,20
LC898128DP1XHTBG
Onsemi
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 1; Terminal Finish: TIN SILVER;
e2
1
TIN SILVER
30
CYPM1111-40LQXIT
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Width: 6 mm;
2.75 V
CYPM1211-40LQXIT
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;
2.7 V
S6J32HELTNSC2D000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP216,1.02SQ,16;
S-PQFP-G216
24 mm
216
HLFQFP
QFP216,1.02SQ,16
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
AEC-Q100; TS 16949
1.7 mm
1.3 V
1.1 V
1.2 V
GULL WING
S6J32JELSNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Width: 24 mm;
125 Cel
S6J32JEKSNSE20000
SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;
S-PQFP-G208
28 mm
208
QFP208,1.2SQ,20
MCIMX6S5DVM10ADR
MCIMX6S5DVM10ADR by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 1.35-1.5V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.
S-PBGA-B624
e1
21 mm
624
95 Cel
BGA624,25X25,32
1.6 mm
1.5 V
1.35 V
TIN SILVER COPPER
XCZU1CG-1SBVA484I
Xilinx
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 250; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1;
4
250
Tin/Silver/Copper (Sn/Ag/Cu)
XCZU1CG-1SFVA625I
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Peak Reflow Temperature (C): 250;
XCZU1CG-2SFVA625E
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 250; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCZU1CG-2SFVC784E
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Peak Reflow Temperature (C): 250;
XCZU1CG-2SFVC784I
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 4; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
XCZU1CG-L2SFVA625E
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;
XCZU1EG-1SFVA625I
MICROPROCESSOR CIRCUIT; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4;
XCZU1EG-2SFVA625E
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
XCZU1CG-1SBVA484E
MICROPROCESSOR CIRCUIT; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 250;
XCZU1CG-1SFVC784E
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Peak Reflow Temperature (C): 250; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCZU1CG-2SFVA625I
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 4; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Peak Reflow Temperature (C): 250; JESD-609 Code: e1;
XCZU1EG-2SBVA484E
MICROPROCESSOR CIRCUIT; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;
XCZU1EG-2SBVA484I
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 250;
XCZU1EG-2SFVA625I
MICROPROCESSOR CIRCUIT; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;
XCZU1EG-L1SFVA625I
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 4;
XCZU1EG-2SFVC784E
MICROPROCESSOR CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 4;
XCZU1EG-2SFVC784I
MICROPROCESSOR CIRCUIT; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30;
XCZU1EG-L1SBVA484I
MICROPROCESSOR CIRCUIT; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4;
XCZU1EG-L2SFVA625E
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
XCZU1EG-L2SFVC784E
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 250; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1;
XCZU1CG-1SFVC784I
MICROPROCESSOR CIRCUIT; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
XCZU1CG-2SBVA484E
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 250;
XCZU1CG-L1SFVC784I
XCZU1CG-L2SBVA484E
MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1;
XCZU1EG-1SFVC784E
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4;
XCZU1EG-1SFVC784I
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30;
XCZU1CG-1SFVA625E
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
XCZU1CG-2SBVA484I
MICROPROCESSOR CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;
XCZU1CG-L1SBVA484I
XCZU1CG-L1SFVA625I
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
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