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UNSPECIFIED Other Function uPs,uCs & Peripheral ICs 10

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
A13 by Allwinner Technology

A13

Allwinner Technology

Allwinner Technology's A13 is a CMOS microprocessor circuit with 176 terminals in a flatpack package. It is used in Other Function uPs and uCs, featuring gull wing terminal form for surface mount applications. Ideal for various peripheral IC applications requiring high performance and compact design.

X-PQFP-G176

176

PLASTIC/EPOXY

HQFP

UNSPECIFIED

FLATPACK, HEAT SINK/SLUG

YES

CMOS

GULL WING

QUAD

MICROPROCESSOR CIRCUIT

DRA746APGABCQ1 by Texas Instruments

DRA746APGABCQ1

Texas Instruments

DRA746APGABCQ1 by Texas Instruments is an AEC-Q100 compliant microprocessor circuit with 760 terminals in a grid array package. It operates at a speed of 1500 rpm, suitable for automotive applications due to its CMOS technology and tin silver copper terminal finish. The device can withstand peak reflow temperatures up to 250°C for 30 seconds, making it ideal for automotive electronic systems.

X-PBGA-B760

e1

3

760

PLASTIC/EPOXY

BGA

UNSPECIFIED

GRID ARRAY

250

AEC-Q100

1500 rpm

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

MF3ICDH2101DUD/05 by NXP Semiconductors

MF3ICDH2101DUD/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;

X-XUUC-N

70 Cel

-25 Cel

UNSPECIFIED

DIE

WAFER

UNSPECIFIED

UNCASED CHIP

Not Qualified

Other Microprocessor ICs

YES

CMOS

OTHER

NO LEAD

UPPER

MICROPROCESSOR CIRCUIT

MF3ICDH4101DUD/05 by NXP Semiconductors

MF3ICDH4101DUD/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER;

X-XUUC-N

70 Cel

-25 Cel

UNSPECIFIED

DIE

WAFER

UNSPECIFIED

UNCASED CHIP

Not Qualified

Other Microprocessor ICs

YES

CMOS

OTHER

NO LEAD

UPPER

MICROPROCESSOR CIRCUIT

MF3ICDH8101DUD/05 by NXP Semiconductors

MF3ICDH8101DUD/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;

X-XUUC-N

70 Cel

-25 Cel

UNSPECIFIED

DIE

WAFER

UNSPECIFIED

UNCASED CHIP

Not Qualified

Other Microprocessor ICs

YES

CMOS

OTHER

NO LEAD

UPPER

MICROPROCESSOR CIRCUIT

MF3MODH2101DA4/05 by NXP Semiconductors

MF3MODH2101DA4/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; JESD-30 Code: X-PXMA-N;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH2101DA8/05 by NXP Semiconductors

MF3MODH2101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel; Package Body Material: PLASTIC/EPOXY;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH4101DA8/05 by NXP Semiconductors

MF3MODH4101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Maximum Operating Temperature: 70 Cel;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH8101DA4/05 by NXP Semiconductors

MF3MODH8101DA4/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT

MF3MODH8101DA8/05 by NXP Semiconductors

MF3MODH8101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Maximum Operating Temperature: 70 Cel; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

X-PXMA-N

70 Cel

-25 Cel

PLASTIC/EPOXY

UNSPECIFIED

MICROELECTRONIC ASSEMBLY

YES

CMOS

OTHER

NO LEAD

UNSPECIFIED

MICROPROCESSOR CIRCUIT