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HLFQFP Other Function uPs,uCs & Peripheral ICs 12

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
S6J32HELTNSC2D000 by Infineon Technologies

S6J32HELTNSC2D000

Infineon Technologies

SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP216,1.02SQ,16;

S-PQFP-G216

24 mm

216

105 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

QFP216,1.02SQ,16

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

AEC-Q100; TS 16949

1.7 mm

1.3 V

1.1 V

1.2 V

YES

CMOS

GULL WING

.4 mm

QUAD

24 mm

SoC

S6J32JELSNSC20000 by Infineon Technologies

S6J32JELSNSC20000

Infineon Technologies

SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Width: 24 mm;

S-PQFP-G216

24 mm

216

125 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

QFP216,1.02SQ,16

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

AEC-Q100; TS 16949

1.7 mm

1.3 V

1.1 V

1.2 V

YES

CMOS

GULL WING

.4 mm

QUAD

24 mm

SoC

S6J32JEKSNSE20000 by Infineon Technologies

S6J32JEKSNSE20000

Infineon Technologies

SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;

S-PQFP-G208

28 mm

208

125 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

AEC-Q100; TS 16949

1.7 mm

1.3 V

1.1 V

1.2 V

YES

CMOS

GULL WING

.5 mm

QUAD

28 mm

SoC

CY8C6144AZI-S4F92 by Infineon Technologies

CY8C6144AZI-S4F92

Infineon Technologies

CY8C6144AZI-S4F92 by Infineon Technologies is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. This IC is ideal for applications requiring low-profile, fine-pitch packages in surface-mount configurations.

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PROGRAMMABLE SoC

CY8C6144AZI-S4F82 by Infineon Technologies

CY8C6144AZI-S4F82

Infineon Technologies

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Terminal Position: QUAD;

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PROGRAMMABLE SoC

CY8C6144AZI-S4F62 by Infineon Technologies

CY8C6144AZI-S4F62

Infineon Technologies

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Equivalence Code: HQFP64,.47SQ,20;

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PROGRAMMABLE SoC

CY8C6144AZQ-S4F92 by Infineon Technologies

CY8C6144AZQ-S4F92

Infineon Technologies

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES;

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PROGRAMMABLE SoC

CY8C6144AZI-S4F12 by Infineon Technologies

CY8C6144AZI-S4F12

Infineon Technologies

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Width: 10 mm;

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PROGRAMMABLE SoC

CY8C6244AZI-S4D82 by Infineon Technologies

CY8C6244AZI-S4D82

Infineon Technologies

Infineon's CY8C6244AZI-S4D82 is a 64-terminal SoC with CMOS technology. Operating b/w -40 to 85 °C, it supports supply voltage range of 1.7-3.6 V. Ideal for applications requiring low profile and fine pitch package styles in surface mount configurations.

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

SoC

CY8C6244AZI-S4D12 by Infineon Technologies

CY8C6244AZI-S4D12

Infineon Technologies

SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

SoC

CY8C6244AZI-S4D62 by Infineon Technologies

CY8C6244AZI-S4D62

Infineon Technologies

CY8C6244AZI-S4D62 by Infineon: 64-terminal SoC with CMOS tech, 1.7-3.6V supply, -40 to 85°C temp range. Ideal for applications requiring low-profile, fine-pitch ICs in plastic/epoxy packages.

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

SoC

CY8C6244AZQ-S4D92 by Infineon Technologies

CY8C6244AZQ-S4D92

Infineon Technologies

SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PQFP-G64

10 mm

3

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

HQFP64,.47SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.6 mm

3.6 V

1.7 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

SoC