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780 Other Function uPs,uCs & Peripheral ICs 59

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LS1084AXE7Q1A by NXP Semiconductors

LS1084AXE7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXN7MQA by NXP Semiconductors

LS1084AXN7MQA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXN7PTA by NXP Semiconductors

LS1084AXN7PTA

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.055 V;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1084AXN7Q1A by NXP Semiconductors

LS1084AXN7Q1A

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.055 V

.995 V

1.025 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1046AXE8Q1A by NXP Semiconductors

LS1046AXE8Q1A

NXP Semiconductors

LS1046AXE8Q1A by NXP Semiconductors is a 780-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high performance in a compact form factor.

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

LS1043ASN8KNLB by NXP Semiconductors

LS1043ASN8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8KNLB by NXP Semiconductors

LS1043ASE8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8MNLB by NXP Semiconductors

LS1043ASE8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASN8MNLB by NXP Semiconductors

LS1043ASN8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ABE9MQB by NXP Semiconductors

LS1043ABE9MQB

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ACE9MQB by NXP Semiconductors

LS1043ACE9MQB

NXP Semiconductors

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP