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770 Other Function uPs,uCs & Peripheral ICs 4

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TDA4VE88TGAALZRQ1 by Texas Instruments

TDA4VE88TGAALZRQ1

Texas Instruments

TDA4VE88TGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 0.76V to 0.84V. This IC has 770 terminals in a GRID ARRAY package style and is suitable for automotive applications under AEC-Q100 and ISO 26262 standards.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

TDA4AL88TGAALZRQ1 by Texas Instruments

TDA4AL88TGAALZRQ1

Texas Instruments

TDA4AL88TGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has 770 terminals in a GRID ARRAY, FINE PITCH package style. Ideal for automotive applications meeting AEC-Q100 and ISO 26262 standards.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

TDA4VL21HGAALZRQ1 by Texas Instruments

TDA4VL21HGAALZRQ1

Texas Instruments

TDA4VL21HGAALZRQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 0.76V to 0.84V. Ideal for automotive applications due to AEC-Q100 and ISO 26262 screening levels.

S-PBGA-B770

23 mm

3

770

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

AEC-Q100; ISO 26262

2.57 mm

1200 rpm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

23 mm

SYSTEM ON CHIP

AM68A92ATGGHAALZR by Texas Instruments

AM68A92ATGGHAALZR

Texas Instruments

AM68A92ATGGHAALZR by Texas Instruments is a SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.76V to 0.84V. This IC has 770 terminals in a grid array package style, suitable for various applications requiring high performance and compact design.

S-PBGA-B770

23 mm

3

770

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA770,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.57 mm

.84 V

.76 V

.8 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

SoC