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3340 Other Function uPs,uCs & Peripheral ICs 10

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCVP1502-1LSEVSVA3340 by Xilinx

XCVP1502-1LSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

S-PBGA-B3340

55 mm

3340

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1402-2LSEVSVA3340 by Xilinx

XCVP1402-2LSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B3340

55 mm

3340

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1402-1LSIVSVA3340 by Xilinx

XCVP1402-1LSIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B3340

55 mm

3340

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1502-1MSEVSVA3340 by Xilinx

XCVP1502-1MSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

S-PBGA-B3340

55 mm

3340

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1502-2LLEVSVA3340 by Xilinx

XCVP1502-2LLEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;

S-PBGA-B3340

55 mm

3340

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1502-2LSEVSVA3340 by Xilinx

XCVP1502-2LSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B3340

55 mm

3340

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1502-3HSEVSVA3340 by Xilinx

XCVP1502-3HSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4.4 mm;

S-PBGA-B3340

55 mm

3340

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1402-1LSEVSVA3340 by Xilinx

XCVP1402-1LSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B3340

55 mm

3340

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1402-2LLEVSVA3340 by Xilinx

XCVP1402-2LLEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B3340

55 mm

3340

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT

XCVP1402-1LLIVSVA3340 by Xilinx

XCVP1402-1LLIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;

S-PBGA-B3340

55 mm

3340

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA3340,58X58,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4.48 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

55 mm

MICROPROCESSOR CIRCUIT