Loading...

324 Other Function uPs,uCs & Peripheral ICs 3

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LH7A404N0E000B0A by NXP Semiconductors

LH7A404N0E000B0A

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;

S-XBGA-B324

324

70 Cel

0 Cel

CERAMIC

FBGA

BGA324,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

DLPC230TZDQRQ1 by Texas Instruments

DLPC230TZDQRQ1

Texas Instruments

DLPC230TZDQRQ1 by Texas Instruments is a CMOS microprocessor circuit with 324 terminals in a grid array package. It operates b/w -40 to 105 °C, suitable for industrial applications. With a supply voltage range of 1.045V to 1.155V, it is ideal for various functions in automotive electronics and other peripheral ICs.

S-PBGA-B324

23 mm

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

2.352 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT

DLPC230TZDQQ1 by Texas Instruments

DLPC230TZDQQ1

Texas Instruments

DLPC230TZDQQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range of -40 to 105°C, with a supply voltage ranging from 1.045V to 1.155V. This device comes in a square GRID ARRAY package and is suitable for various applications requiring high-performance microprocessor circuits.

S-PBGA-B324

23 mm

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

2.352 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT