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306 Other Function uPs,uCs & Peripheral ICs 4

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MIMX8MN5DVPIZCA by NXP Semiconductors

MIMX8MN5DVPIZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B306

11 mm

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

SoC

MIMX8MN3DVPIZAA by NXP Semiconductors

MIMX8MN3DVPIZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN3DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and compact design in various electronic devices.

S-PBGA-B306

11 mm

3

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

11 mm

SoC

MIMX8MN1DVPIZAA by NXP Semiconductors

MIMX8MN1DVPIZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN1DVPIZAA is a SoC with 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and low power consumption in compact electronic devices.

S-PBGA-B306

11 mm

3

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

11 mm

SoC

MIMX8MN5DVPIZDA by NXP Semiconductors

MIMX8MN5DVPIZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B306

11 mm

306

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA306,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.01 mm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

11 mm

SoC