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1760 Other Function uPs,uCs & Peripheral ICs 146

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCVM1502-1LSEVFVC1760 by Xilinx

XCVM1502-1LSEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1760

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

.724 V

.676 V

.7 V

YES

CMOS

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

XCVM1502-1MSEVFVC1760 by Xilinx

XCVM1502-1MSEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1760;

S-PBGA-B1760

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

.825 V

.775 V

.8 V

YES

CMOS

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

XCVM1502-2MLIVFVC1760 by Xilinx

XCVM1502-2MLIVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1760

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

.825 V

.775 V

.8 V

YES

CMOS

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

XCVM1802-1MSIVSVD1760 by Xilinx

XCVM1802-1MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1760

e1

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

TIN SILVER COPPER

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1802-2LSEVFVC1760 by Xilinx

XCVM1802-2LSEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1760;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1760,42X42,36

SQUARE

GRID ARRAY

3.89 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1802-2MSIVFVC1760 by Xilinx

XCVM1802-2MSIVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1760,42X42,36

SQUARE

GRID ARRAY

3.89 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1LSEVSVD1760 by Xilinx

XCVM1302-1LSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Length: 40 mm;

S-PBGA-B1760

40 mm

1760

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1LSIVSVD1760 by Xilinx

XCVM1302-1LSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1MSIVSVD1760 by Xilinx

XCVM1302-1MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2MSEVSVD1760 by Xilinx

XCVM1302-2MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1760,42X42,36;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1MSEVSVD1760 by Xilinx

XCVM1402-1MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

S-PBGA-B1760

40 mm

1760

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2LLEVSVD1760 by Xilinx

XCVM1302-2LLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Width: 40 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2MLEVSVD1760 by Xilinx

XCVM1302-2MLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2MSIVSVD1760 by Xilinx

XCVM1302-2MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1LSIVSVD1760 by Xilinx

XCVM1402-1LSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1760;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2LLEVSVD1760 by Xilinx

XCVM1402-2LLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2MLIVSVD1760 by Xilinx

XCVC1802-2MLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-1MSEVSVD1760 by Xilinx

XCVC1902-1MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

S-PBGA-B1760

40 mm

1760

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2LSEVSVD1760 by Xilinx

XCVC1902-2LSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2MSEVSVD1760 by Xilinx

XCVC1902-2MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Length: 40 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-1LLIVSVD1760 by Xilinx

XCVC1902-1LLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-1LSIVSVD1760 by Xilinx

XCVC1902-1LSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .7 V;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-1MLIVSVD1760 by Xilinx

XCVC1902-1MLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-1MSIVSVD1760 by Xilinx

XCVC1902-1MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2MLEVSVD1760 by Xilinx

XCVC1902-2MLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-1LLIVSVD1760 by Xilinx

XCVC1802-1LLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-1LSIVSVD1760 by Xilinx

XCVC1802-1LSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .7 V;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-1MLIVSVD1760 by Xilinx

XCVC1802-1MLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Width: 40 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-1MSIVSVD1760 by Xilinx

XCVC1802-1MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2LLEVSVD1760 by Xilinx

XCVC1802-2LLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2MLEVSVD1760 by Xilinx

XCVC1802-2MLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2MSIVSVD1760 by Xilinx

XCVC1802-2MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-1LSEVSVD1760 by Xilinx

XCVC1902-1LSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

S-PBGA-B1760

40 mm

1760

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-1LSEVSVD1760 by Xilinx

XCVC1802-1LSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1760

40 mm

1760

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-1MSEVSVD1760 by Xilinx

XCVC1802-1MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;

S-PBGA-B1760

40 mm

1760

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2LSEVSVD1760 by Xilinx

XCVC1802-2LSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2MSEVSVD1760 by Xilinx

XCVC1802-2MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2LLEVSVD1760 by Xilinx

XCVC1902-2LLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1760

40 mm

1760

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2MLIVSVD1760 by Xilinx

XCVC1902-2MLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Length: 40 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2MSIVSVD1760 by Xilinx

XCVC1902-2MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Width: 40 mm;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1802-2LLIVFVC1760 by Xilinx

XCVM1802-2LLIVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .7 V;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1760,42X42,36

SQUARE

GRID ARRAY

3.89 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2HSIVSVD1760 by Xilinx

XCVC1802-2HSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1802-2LLIVSVD1760 by Xilinx

XCVC1802-2LLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1802-2HSIVSVD1760 by Xilinx

XCVM1802-2HSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1760

e1

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

TIN SILVER COPPER

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2HSIVSVD1760 by Xilinx

XCVM1302-2HSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVC1902-2LLIVSVD1760 by Xilinx

XCVC1902-2LLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1802-2LLIVSVD1760 by Xilinx

XCVM1802-2LLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1760

e1

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.724 V

.676 V

.7 V

YES

CMOS

TIN SILVER COPPER

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2HSIVSVD1760 by Xilinx

XCVM1402-2HSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1760

40 mm

1760

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1760,42X42,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

4 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

40 mm

MICROPROCESSOR CIRCUIT