Loading...

1156 Other Function uPs,uCs & Peripheral ICs 79

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCZU6CG-2FFVB1156E by Xilinx

XCZU6CG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU6EG-2FFVB1156E by Xilinx

XCZU6EG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU7CG-2FFVC1156E by Xilinx

XCZU7CG-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU7EG-2FFVC1156E by Xilinx

XCZU7EG-2FFVC1156E

Xilinx

The Xilinx XCZU7EG-2FFVC1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance processing capabilities in compact form factors.

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU7EV-2FFVC1156E by Xilinx

XCZU7EV-2FFVC1156E

Xilinx

XCZU7EV-2FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high performance and reliability in compact designs.

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU9CG-2FFVB1156E by Xilinx

XCZU9CG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU9EG-2FFVB1156E by Xilinx

XCZU9EG-2FFVB1156E

Xilinx

The Xilinx XCZU9EG-2FFVB1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance computing and signal processing capabilities.

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU47DR-1FFVE1156E by Xilinx

XCZU47DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FFVE1156I by Xilinx

XCZU47DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVE1156E by Xilinx

XCZU47DR-1FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVE1156I by Xilinx

XCZU47DR-1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVE1156E by Xilinx

XCZU47DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVE1156I by Xilinx

XCZU47DR-2FFVE1156I

Xilinx

The Xilinx XCZU47DR-2FFVE1156I is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 1156 terminals in a grid array package, it's ideal for industrial applications requiring high-performance computing capabilities.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVE1156E by Xilinx

XCZU47DR-2FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVE1156I by Xilinx

XCZU47DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FFVE1156I by Xilinx

XCZU47DR-L1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FSVE1156I by Xilinx

XCZU47DR-L1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FFVE1156I by Xilinx

XCZU47DR-L2FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FSVE1156I by Xilinx

XCZU47DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVE1156E by Xilinx

XCZU48DR-1FFVE1156E

Xilinx

XCZU48DR-1FFVE1156E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for Other Function uPs,uCs & Peripheral ICs applications due to its low supply voltage range of 0.825-0.876 V and high peak reflow temperature of 245C.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVE1156I by Xilinx

XCZU48DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVE1156E by Xilinx

XCZU48DR-1FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVE1156I by Xilinx

XCZU48DR-1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVE1156E by Xilinx

XCZU48DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVE1156I by Xilinx

XCZU48DR-2FFVE1156I

Xilinx

XCZU48DR-2FFVE1156I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Suitable for industrial applications, it features a grid array package style and 1156 terminals for surface mount assembly.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVE1156E by Xilinx

XCZU48DR-2FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVE1156I by Xilinx

XCZU48DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FFVE1156I by Xilinx

XCZU48DR-L1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FSVE1156I by Xilinx

XCZU48DR-L1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FFVE1156I by Xilinx

XCZU48DR-L2FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FSVE1156I by Xilinx

XCZU48DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC