Loading...

1024 Other Function uPs,uCs & Peripheral ICs 26

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCVM1302-2LLENBVB1024 by Xilinx

XCVM1302-2LLENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2LSENBVB1024 by Xilinx

XCVM1302-2LSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1MLINBVB1024 by Xilinx

XCVM1302-1MLINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Width: 31 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1MSINBVB1024 by Xilinx

XCVM1302-1MSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2MSINBVB1024 by Xilinx

XCVM1302-2MSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2LLENBVB1024 by Xilinx

XCVM1402-2LLENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Width: 31 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2MLINBVB1024 by Xilinx

XCVM1302-2MLINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Width: 31 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1LLINBVB1024 by Xilinx

XCVM1402-1LLINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1MSENBVB1024 by Xilinx

XCVM1402-1MSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;

S-PBGA-B1024

31 mm

1024

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2MSINBVB1024 by Xilinx

XCVM1402-2MSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2MSENBVB1024 by Xilinx

XCVM1402-2MSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1MSENBVB1024 by Xilinx

XCVM1302-1MSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1024

31 mm

1024

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2MLENBVB1024 by Xilinx

XCVM1302-2MLENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1LSINBVB1024 by Xilinx

XCVM1402-1LSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1MLINBVB1024 by Xilinx

XCVM1402-1MLINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 2.94 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1MSINBVB1024 by Xilinx

XCVM1402-1MSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2MLENBVB1024 by Xilinx

XCVM1402-2MLENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1LLINBVB1024 by Xilinx

XCVM1302-1LLINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1LSENBVB1024 by Xilinx

XCVM1302-1LSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1024,32X32,36;

S-PBGA-B1024

31 mm

1024

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-1LSINBVB1024 by Xilinx

XCVM1302-1LSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2MSENBVB1024 by Xilinx

XCVM1302-2MSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-1LSENBVB1024 by Xilinx

XCVM1402-1LSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1024

31 mm

1024

100 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2LSENBVB1024 by Xilinx

XCVM1402-2LSENBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B1024

31 mm

1024

110 Cel

0 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.724 V

.676 V

.7 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2MLINBVB1024 by Xilinx

XCVM1402-2MLINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1024,32X32,36;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.825 V

.775 V

.8 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1402-2HSINBVB1024 by Xilinx

XCVM1402-2HSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT

XCVM1302-2HSINBVB1024 by Xilinx

XCVM1302-2HSINBVB1024

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B1024

31 mm

1024

110 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA1024,32X32,36

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.94 mm

.906 V

.854 V

.88 V

YES

CMOS

BALL

.92 mm

BOTTOM

31 mm

MICROPROCESSOR CIRCUIT