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364 Microprocessors 6

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MVF50NN152CMK50 by NXP Semiconductors

MVF50NN152CMK50

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Maximum Clock Frequency: 24 MHz;

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PBGA-B364

e1

17 mm

YES

3

32

0

7

364

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA364,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1572864

1.5 mm

500 rpm

850 mA

1.1 V

.9 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MVF50NS152CMK50R by NXP Semiconductors

MVF50NS152CMK50R

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PBGA-B364

e1

17 mm

YES

3

32

0

7

364

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA364,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1572864

1.5 mm

500 rpm

850 mA

1.1 V

.9 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MVF60NN152CMK40 by NXP Semiconductors

MVF60NN152CMK40

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PBGA-B364

e1

17 mm

YES

3

32

0

7

364

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA364,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1572864

1.5 mm

400 rpm

850 mA

1.1 V

.9 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MVF60NN152CMK50 by NXP Semiconductors

MVF60NN152CMK50

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; No. of DMA Channels: 32;

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PBGA-B364

e1

17 mm

YES

3

32

0

7

364

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA364,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1572864

1.5 mm

500 rpm

850 mA

1.1 V

.9 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MVF60NS152CMK40 by NXP Semiconductors

MVF60NS152CMK40

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PBGA-B364

e1

17 mm

YES

3

32

0

7

364

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA364,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1572864

1.5 mm

400 rpm

850 mA

1.1 V

.9 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MVF60NS152CMK50 by NXP Semiconductors

MVF60NS152CMK50

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PBGA-B364

e1

17 mm

YES

3

32

0

7

364

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA364,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1572864

1.5 mm

500 rpm

850 mA

1.1 V

.9 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC