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HSSOP Power Management ICs 40

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage Normal Position (V) No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Output (V) Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Protection(s) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Maximum Switch-on Time Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
TLE7368-3E by Infineon Technologies

TLE7368-3E

Infineon Technologies

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Form: GULL WING;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G36

e3

12.8 mm

3

1

1

36

PLASTIC/EPOXY

HSSOP

SSOP36,.56

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

4.5/45

Not Qualified

2.55 mm

Power Management Circuits

45 V

4.5 V

13.5 V

YES

CMOS

MATTE TIN

GULL WING

.65 mm

DUAL

7.6 mm

LM5064PMH/NOPB by Texas Instruments

LM5064PMH/NOPB

Texas Instruments

LM5064PMH/NOPB by Texas Instruments is a Power Management IC with 28 terminals, operating at -40 to 125°C. It supports supply voltages from 10V to 80V and has an output current of 500A. Ideal for automotive applications due to its small size and adjustable threshold feature.

YES

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G28

e3

9.7 mm

3

1

1

28

125 Cel

-40 Cel

500 A

PLASTIC/EPOXY

HSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

48

Not Qualified

1 mm

Power Management Circuits

8 mA

80 V

10 V

48 V

YES

AUTOMOTIVE

MATTE TIN

GULL WING

.65 mm

DUAL

30

4.4 mm

LM5064PMHE/NOPB by Texas Instruments

LM5064PMHE/NOPB

Texas Instruments

LM5064PMHE/NOPB by Texas Instruments is a Power Management IC with 28 terminals, suitable for automotive applications. It operates at a nominal voltage of 48V and has a max output current of 500A. With surface mount capability and a small outline package style, it offers adjustable threshold functionality for power supply support circuits.

YES

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G28

e3

9.7 mm

3

1

1

28

125 Cel

-40 Cel

500 A

PLASTIC/EPOXY

HSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

48

Not Qualified

1.2 mm

Power Management Circuits

8 mA

80 V

10 V

48 V

YES

AUTOMOTIVE

MATTE TIN

GULL WING

.65 mm

DUAL

30

4.4 mm

LM5064PMHX/NOPB by Texas Instruments

LM5064PMHX/NOPB

Texas Instruments

LM5064PMHX/NOPB by Texas Instruments is a Power Management IC with 28 terminals, operating at -40 to 125 °C. It supports a supply voltage range of 10-80 V and offers an output current of up to 500 A. Ideal for automotive applications due to its compact size and high thermal performance.

YES

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G28

e3

9.7 mm

3

1

1

28

125 Cel

-40 Cel

500 A

PLASTIC/EPOXY

HSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

48

Not Qualified

1.2 mm

Power Management Circuits

8 mA

80 V

10 V

48 V

YES

AUTOMOTIVE

MATTE TIN

GULL WING

.65 mm

DUAL

30

4.4 mm

TLE7368EXUMA1 by Infineon Technologies

TLE7368EXUMA1

Infineon Technologies

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: DUAL;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G36

12.8 mm

1

1

36

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

NOT SPECIFIED

Not Qualified

2.55 mm

45 V

4.5 V

13.5 V

YES

CMOS

GULL WING

.65 mm

DUAL

NOT SPECIFIED

7.6 mm

TLE7368GNUMA1 by Infineon Technologies

TLE7368GNUMA1

Infineon Technologies

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Qualification: Not Qualified;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G36

15.9 mm

1

1

36

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

NOT SPECIFIED

Not Qualified

3.5 mm

45 V

4.5 V

13.5 V

YES

CMOS

GULL WING

.65 mm

DUAL

NOT SPECIFIED

11 mm

TLE73682EXUMA1 by Infineon Technologies

TLE73682EXUMA1

Infineon Technologies

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Seated Height: 2.55 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G36

12.8 mm

1

1

36

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

NOT SPECIFIED

2.55 mm

45 V

4.5 V

13.5 V

YES

CMOS

GULL WING

.65 mm

DUAL

NOT SPECIFIED

7.6 mm

BTS500801EGAAUMA1 by Infineon Technologies

BTS500801EGAAUMA1

Infineon Technologies

POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 12; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Width (mm): 6.4 mm;

NO

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G12

7.5 mm

1

1

12

150 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

SSOP12,.4,39

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

AEC-Q100

2.6 mm

24 mA

16 V

9 V

13.5 V

YES

GULL WING

1 mm

DUAL

+2.8V

6.4 mm

L9952GXPTR by STMicroelectronics

L9952GXPTR

STMicroelectronics

L9952GXPTR from STMicroelectronics is a versatile power management IC with a nominal voltage of 13.5V, supporting a range of 6-18V. It features a compact 36-terminal design and operates efficiently in surface mount applications. Ideal for automotive and industrial power supply management, it ensures reliable performance in demanding environments.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G36

e3

10.3 mm

3

1

1

36

PLASTIC/EPOXY

HSSOP

SSOP36,.4,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

6/18

Not Qualified

2.47 mm

Power Management Circuits

18 V

6 V

13.5 V

YES

CMOS

MATTE TIN

GULL WING

.5 mm

DUAL

7.5 mm

L9952GXP by STMicroelectronics

L9952GXP

STMicroelectronics

L9952GXP by STMicroelectronics is a versatile power management IC with a nominal voltage of 13.5 V and supports a range from 6 to 18 V. It features a compact design with 36 terminals in a small outline package, ideal for efficient power supply management in various applications. Its CMOS technology ensures reliable performance in demanding environments.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G36

e3

10.3 mm

3

1

1

36

PLASTIC/EPOXY

HSSOP

SSOP36,.4,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

6/18

Not Qualified

2.47 mm

Power Management Circuits

18 V

6 V

13.5 V

YES

CMOS

MATTE TIN

GULL WING

.5 mm

DUAL

7.5 mm

MAX5907UEE by Maxim Integrated

MAX5907UEE

Maxim Integrated

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

CHANNEL 1 SUPPLY INPUT IS 5V NOMINAL

YES

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G16

e0

4.89 mm

1

2

1

16

85 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

245

1/13.2

Not Qualified

1.75 mm

Power Management Circuits

2.3 mA

13.2 V

1 V

3.3 V

YES

BICMOS

OTHER

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

MCZ33903D3EKR2 by NXP Semiconductors

MCZ33903D3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903D3EK by NXP Semiconductors

MCZ33903D3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903D5EKR2 by NXP Semiconductors

MCZ33903D5EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903D5EK by NXP Semiconductors

MCZ33903D5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DD3EKR2 by NXP Semiconductors

MCZ33903DD3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DD3EK by NXP Semiconductors

MCZ33903DD3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DD5EKR2 by NXP Semiconductors

MCZ33903DD5EKR2

NXP Semiconductors

MCZ33903DD5EKR2 by NXP Semiconductors is a Power Management IC with 32 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 5.5V to 28V and features adjustable threshold. Ideal for automotive applications due to its MOS technology and compact design with small outline package style.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DD5EK by NXP Semiconductors

MCZ33903DD5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DP3EKR2 by NXP Semiconductors

MCZ33903DP3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DP5EKR2 by NXP Semiconductors

MCZ33903DP5EKR2

NXP Semiconductors

MCZ33903DP5EKR2 by NXP Semiconductors is a Power Management IC with 32 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 5.5V to 28V and features an adjustable threshold for automotive applications. The package style is small outline with gull wing terminals, suitable for surface mount assembly at peak reflow temperature of 260C.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DP5EK by NXP Semiconductors

MCZ33903DP5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DS3EKR2 by NXP Semiconductors

MCZ33903DS3EKR2

NXP Semiconductors

MCZ33903DS3EKR2 by NXP Semiconductors is a Power Management IC with 32 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 5.5V to 28V and features an adjustable threshold for automotive applications. The package style is small outline with gull wing terminals, suitable for surface mount assembly at peak reflow temperature of 260C.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DS3EK by NXP Semiconductors

MCZ33903DS3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DS5EKR2 by NXP Semiconductors

MCZ33903DS5EKR2

NXP Semiconductors

MCZ33903DS5EKR2 by NXP Semiconductors is a Power Management IC with 32 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 5.5V to 28V and features adjustable threshold. Ideal for automotive applications due to its MOS technology and compact design with small outline package style.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33903DS5EK by NXP Semiconductors

MCZ33903DS5EK

NXP Semiconductors

MCZ33903DS5EK by NXP Semiconductors is a Power Management IC with 32 terminals, operating voltage range of 5.5V to 28V, and temperature grade suitable for automotive applications. It features a small outline package with dimensions of 11mm x 7.5mm x 2.45mm and MOS technology, making it ideal for power supply management circuits in automotive systems.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33904D3EKR2 by NXP Semiconductors

MCZ33904D3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33904D3EK by NXP Semiconductors

MCZ33904D3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33904D5EKR2 by NXP Semiconductors

MCZ33904D5EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33904D5EK by NXP Semiconductors

MCZ33904D5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DD3EKR2 by NXP Semiconductors

MCZ33905DD3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 54; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G54

e3

17.9 mm

3

1

1

54

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DD3EK by NXP Semiconductors

MCZ33905DD3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 54; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G54

e3

17.9 mm

3

1

1

54

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DD5EKR2 by NXP Semiconductors

MCZ33905DD5EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 54; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G54

e3

17.9 mm

3

1

1

54

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DD5EK by NXP Semiconductors

MCZ33905DD5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 54; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G54

e3

17.9 mm

3

1

1

54

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DS3EKR2 by NXP Semiconductors

MCZ33905DS3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DS3EK by NXP Semiconductors

MCZ33905DS3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DS5EKR2 by NXP Semiconductors

MCZ33905DS5EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

MCZ33905DS5EK by NXP Semiconductors

MCZ33905DS5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G32

e3

11 mm

3

1

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

28 V

5.5 V

10.5 V

YES

MOS

AUTOMOTIVE

TIN

GULL WING

.65 mm

DUAL

40

7.5 mm

L9001 by STMicroelectronics

L9001

STMicroelectronics

L9001 by STMicroelectronics is a Power Management IC with 24 terminals, suitable for automotive applications. It has an operating temperature range of -40 to 125°C and supports a supply voltage from 5.5V to 18V. This IC features three channels, adjustable threshold, and AEC-Q100 screening level.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

R-PDSO-G24

10.3 mm

3

3

1

24

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

SOP24,.41,32

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

AEC-Q100

2.45 mm

18 V

5.5 V

YES

AUTOMOTIVE

GULL WING

.8 mm

DUAL

+3.25V

7.5 mm

TCB010FNG by Toshiba

TCB010FNG

Toshiba

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

R-PDSO-G36

15.9 mm

1

1

36

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

NOT SPECIFIED

3.41 mm

18 V

4.9 V

13.2 V

YES

CMOS

AUTOMOTIVE

GULL WING

.65 mm

DUAL

NOT SPECIFIED

11 mm