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256 SRAM 2

SRAM
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Ports No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Output Enable Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Self Refresh Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
CYD18S36V18-167BBAI by Cypress Semiconductor

CYD18S36V18-167BBAI

Cypress Semiconductor

CYD18S36V18-167BBAI by Cypress Semiconductor is a 512Kx36 MULTI-PORT SRAM with 167 MHz fCLK. Operating at -40 to 85 °C, it has a low profile GRID ARRAY package and consumes up to 780 mA at 1.5/1.8 Vsup. Ideal for industrial applications requiring fast access times and high memory density.

4 ns

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V

167 MHz

COMMON

S-PBGA-B256

e0

17 mm

18874368 bit

MULTI-PORT SRAM

36

3

1

2

256

524288 words

512K

SYNCHRONOUS

85 Cel

-40 Cel

512KX36

3-STATE

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

PARALLEL

1.5/1.8

Not Qualified

1.7 mm

.35 Amp

1.4 V

SRAMs

780 mA

1.58 V

1.42 V

1.5

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

DS2045W-100 by Maxim Integrated

DS2045W-100

Maxim Integrated

NON-VOLATILE SRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

100 ns

S-PBGA-B256

27 mm

1048576 bit

NON-VOLATILE SRAM MODULE

8

1

256

131072 words

128K

ASYNCHRONOUS

85 Cel

-40 Cel

128KX8

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

PARALLEL

NOT SPECIFIED

Not Qualified

8.72 mm

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

NOT SPECIFIED

27 mm