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66 Other Function Memory ICs 1

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
M36DR432AD10ZA6T by STMicroelectronics

M36DR432AD10ZA6T

STMicroelectronics

M36DR432AD10ZA6T by STMicroelectronics is a low-profile, asynchronous memory IC featuring 2M words of mixed FLASH+SRAM with a supply voltage range of 1.65-2.2V. It operates in extreme temperatures from -40 °C to 85 °C and supports surface mount applications. Ideal for industrial use, it offers fast access times up to 100 ns and minimal standby current.

100 ns

SRAM IS ORGANIZED AS 256K X 16

R-PBGA-B66

e0

12 mm

33554432 bit

MEMORY CIRCUIT

16

FLASH+SRAM

1

66

2097152 words

2M

ASYNCHRONOUS

85 Cel

-40 Cel

2MX16

PLASTIC/EPOXY

LFBGA

BGA66,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8/2

Not Qualified

1.4 mm

.00001 Amp

Other Memory ICs

26 mA

2.2 V

1.65 V

1.8

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

8 mm