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64 Other Function Memory ICs 3

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
NP8P128A13B1760E by Micron Technology

NP8P128A13B1760E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words Code: 16M;

R-PBGA-B64

10 mm

134217728 bit

MEMORY CIRCUIT

8

1

64

16777216 words

16M

SYNCHRONOUS

70 Cel

0 Cel

16MX8

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

8 mm

NP8P128A13T1760E by Micron Technology

NP8P128A13T1760E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 134217728 bit;

R-PBGA-B64

10 mm

134217728 bit

MEMORY CIRCUIT

8

1

64

16777216 words

16M

SYNCHRONOUS

70 Cel

0 Cel

16MX8

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

8 mm

NP8P128AE3T1760E by Micron Technology

NP8P128AE3T1760E

Micron Technology

Micron Technology's NP8P128AE3T1760E is a 16MX8 memory circuit IC with 134217728-bit density. Operating at 3V, it features synchronous mode and industrial temperature grade. With a package style of grid array and thin profile, it is suitable for applications requiring high-speed data storage and retrieval in various electronic devices.

R-PBGA-B64

10 mm

134217728 bit

MEMORY CIRCUIT

8

1

64

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX8

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

8 mm