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169 Other Function Memory ICs 1

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
MTFC16GLTDV-WT by Micron Technology

MTFC16GLTDV-WT

Micron Technology

MTFC16GLTDV-WT by Micron Technology is a memory IC with 137.4TB density, operating at -25 to 85°C. It features 169 terminals in a grid array package for surface mounting applications. Suitable for various electronic devices requiring high-density memory solutions.

R-PBGA-B169

137438953472 bit

169

85 Cel

-25 Cel

PLASTIC/EPOXY

FBGA

BGA169,14X28,20

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8/3.3,3/3.3

Not Qualified

Other Memory ICs

YES

OTHER

BALL

.5 mm

BOTTOM