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16 Other Function Memory ICs 4

Other Function Memory ICs
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Self Refresh Sequential Burst Length Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Write Protection
NP5Q128A13ESFC0E by Micron Technology

NP5Q128A13ESFC0E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

R-PDSO-G16

10.3 mm

134217728 bit

MEMORY CIRCUIT

1

1

16

134217728 words

128M

SYNCHRONOUS

70 Cel

0 Cel

128MX1

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

3/3.3

Not Qualified

2.65 mm

.0002 Amp

SRAMs

50 mA

3.6 V

2.7 V

3

YES

CMOS

COMMERCIAL

GULL WING

1.27 mm

DUAL

NOT SPECIFIED

7.5 mm

NP5Q128AE3ESFC0E by Micron Technology

NP5Q128AE3ESFC0E

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 50 mA;

R-PDSO-G16

10.3 mm

134217728 bit

MEMORY CIRCUIT

8

1

16

16777216 words

16M

SYNCHRONOUS

85 Cel

-40 Cel

16MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

3/3.3

Not Qualified

2.65 mm

.0002 Amp

SRAMs

50 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

NOT SPECIFIED

7.5 mm

MR10Q010SCR by Everspin Technologies

MR10Q010SCR

Everspin Technologies

Everspin Technologies' MR10Q010SCR is a 128KX8 MEMORY CIRCUIT IC with 1048576 bit Memory Density. Operating at 3.3V, it features SYNCHRONOUS mode and has a small outline package style. Ideal for applications requiring high-speed memory access in commercial temperature environments.

R-PDSO-G16

10.34 mm

1048576 bit

MEMORY CIRCUIT

8

1

16

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

1.8,3.3

Not Qualified

2.64 mm

.005 Amp

SRAMs

220 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

1.27 mm

DUAL

NOT SPECIFIED

7.52 mm

CY8C20140-LDX2I by Cypress Semiconductor

CY8C20140-LDX2I

Cypress Semiconductor

CY8C20140-LDX2I by Cypress Semiconductor is a 2KX1 MEMORY CIRCUIT IC with SYNCHRONOUS operation, suitable for INDUSTRIAL applications. It operates at 3V, has 16 terminals in a SQUARE package style, and can withstand temperatures from -40 to 85 °C.

SRAM IS ORGANISED AS 512MB

S-XQCC-N16

e4

3 mm

2048 bit

MEMORY CIRCUIT

1

3

1

16

2048 words

2K

SYNCHRONOUS

85 Cel

-40 Cel

2KX1

UNSPECIFIED

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

Not Qualified

.6 mm

5.25 V

2.4 V

3

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

20

3 mm