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TBGA FRAMs 10

FRAMs
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Maximum Clock Frequency (fCLK) Minimum Data Retention Time Endurance JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Serial Bus Type Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Write Protection
CY15B116QN-40BKXA by Infineon Technologies

CY15B116QN-40BKXA

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Maximum Supply Current: 4.3 mA;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002535 Amp

1.8 V

4.3 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V116QN-40BKXAT by Infineon Technologies

CY15V116QN-40BKXAT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Package Body Material: PLASTIC/EPOXY;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002525 Amp

1.71 V

3.6 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V116QN-40BKXA by Infineon Technologies

CY15V116QN-40BKXA

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Technology: CMOS; Serial Bus Type: SPI;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002525 Amp

1.71 V

3.6 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B116QN-40BKXAT by Infineon Technologies

CY15B116QN-40BKXAT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE; Package Style (Meter): GRID ARRAY, THIN PROFILE;

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

40 MHz

10

1000000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

16777216 bit

FRAM

8

1

24

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

AEC-Q100

1.2 mm

SPI

.0002535 Amp

1.8 V

4.3 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QSN-108BKXI by Infineon Technologies

CY15B108QSN-108BKXI

Infineon Technologies

Infineon CY15B108QSN-108BKXI FRAM offers 1MX8 organization, operates at 108 MHz clock frequency, and has a memory density of 8388608 bit. Ideal for applications requiring high endurance with 100T write/erase cycles, such as industrial automation and IoT devices.

108 MHz

10

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000435 Amp

27.5 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QSN-108BKXI by Infineon Technologies

CY15V108QSN-108BKXI

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; Package Equivalence Code: BGA24,5X5,40;

108 MHz

10

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000435 Amp

27.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QN-50BKXQT by Infineon Technologies

CY15B108QN-50BKXQT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Serial Bus Type: SPI;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000305 Amp

1.8 V

8 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15B108QN-50BKXQ by Infineon Technologies

CY15B108QN-50BKXQ

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Width: 6 mm; Minimum Operating Temperature: -40 Cel;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.000305 Amp

1.8 V

8 mA

3.6 V

1.8 V

3.3

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXQ by Infineon Technologies

CY15V108QN-50BKXQ

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 8; Write Protection: HARDWARE/SOFTWARE;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.0003 Amp

1.71 V

7.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE

CY15V108QN-50BKXQT by Infineon Technologies

CY15V108QN-50BKXQT

Infineon Technologies

FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.89 V; Minimum Operating Temperature: -40 Cel;

2kv ESD available

50 MHz

1

100000000000000 Write/Erase Cycles

R-PBGA-B24

8 mm

8388608 bit

FRAM

8

1

24

1048576 words

1M

SYNCHRONOUS

105 Cel

-40 Cel

1MX8

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

1.2 mm

SPI

.0003 Amp

1.71 V

7.5 mA

1.89 V

1.71 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

6 mm

HARDWARE/SOFTWARE