Loading...

152 Flash Memory 7

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
MT29F128G08CBCCBH6-6R:C by Micron Technology

MT29F128G08CBCCBH6-6R:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

R-PBGA-B152

18 mm

137438953472 bit

FLASH

8

1

152

17179869184 words

16G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

16GX8

PLASTIC/EPOXY

VBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

PARALLEL

3.3

1 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F128G08CBECBH6-12:C by Micron Technology

MT29F128G08CBECBH6-12:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Technology: CMOS;

R-PBGA-B152

18 mm

137438953472 bit

FLASH

8

1

152

17179869184 words

16G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

16GX8

PLASTIC/EPOXY

VBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

PARALLEL

3.3

1 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F1T08CUCCBH8-6R:C by Micron Technology

MT29F1T08CUCCBH8-6R:C

Micron Technology

MT29F1T08CUCCBH8-6R:C by Micron Technology is a Flash Memory with 128GX8 organization, 3.3V nominal voltage, and 1099511627776 bit memory density. It is used in applications requiring high-speed data storage and retrieval, such as smartphones, tablets, and solid-state drives (SSDs).

R-PBGA-B152

18 mm

1099511627776 bit

FLASH

8

1

152

137438953472 words

128G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

128GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3.3

1.4 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F256G08CECCBH6-6R:C by Micron Technology

MT29F256G08CECCBH6-6R:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Type: MLC NAND TYPE;

R-PBGA-B152

18 mm

274877906944 bit

FLASH

8

1

152

34359738368 words

32G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

32GX8

PLASTIC/EPOXY

VBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

PARALLEL

3.3

1 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F256G08CEECBH6-12:C by Micron Technology

MT29F256G08CEECBH6-12:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

R-PBGA-B152

18 mm

274877906944 bit

FLASH

8

1

152

34359738368 words

32G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

32GX8

PLASTIC/EPOXY

VBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE

PARALLEL

3.3

1 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F512G08CKCCBH7-6R:C by Micron Technology

MT29F512G08CKCCBH7-6R:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 549755813888 bit;

R-PBGA-B152

18 mm

549755813888 bit

FLASH

8

1

152

68719476736 words

64G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

64GX8

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

PARALLEL

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT29F512G08CKECBH7-12:C by Micron Technology

MT29F512G08CKECBH7-12:C

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

R-PBGA-B152

18 mm

549755813888 bit

FLASH

8

1

152

68719476736 words

64G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

64GX8

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

PARALLEL

3.3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm