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TSOP EEPROM 4

EEPROM
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Maximum Write Cycle Time (tWC) Write Protection
XC17V01VO8C by Xilinx

XC17V01VO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;

15 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

1048576 bit

CONFIGURATION MEMORY

1

3

1

8

1048576 words

1M

SYNCHRONOUS

70 Cel

0 Cel

1MX1

3-STATE

PLASTIC/EPOXY

TSOP

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

3.3

Not Qualified

1.2 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

XC17V01VO8I by Xilinx

XC17V01VO8I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;

15 MHz

COMMON

R-PDSO-G8

e0

4.9 mm

1048576 bit

CONFIGURATION MEMORY

1

3

1

8

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX1

3-STATE

PLASTIC/EPOXY

TSOP

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

3.3

Not Qualified

1.2 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.9 mm

NV24C32DTVLT3G by Onsemi

NV24C32DTVLT3G

Onsemi

NV24C32DTVLT3G by Onsemi is an AEC-Q100 EEPROM with 128x32 organization, operating from -40 to 125 °C. It features I2C serial bus, 1MHz clock frequency, and 32K words code. Ideal for automotive applications requiring reliable data storage in a compact form factor.

1 MHz

NO

YES

1000000 Write/Erase Cycles

R-PDSO-G8

e4

4.4 mm

32768 bit

EEPROM

8

1

1

1

8

4096 words

32K

SYNCHRONOUS

125 Cel

-40 Cel

128X32

PLASTIC/EPOXY

TSOP

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

32

SERIAL

260

NO

AEC-Q100

1.2 mm

I2C

.000002 Amp

1 mA

5.5 V

1.7 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

3 mm

4 ms

HARDWARE

AT28HC256E-90TU-T by Microchip Technology

AT28HC256E-90TU-T

Microchip Technology

AT28HC256E-90TU-T by Microchip Tech: 32KX8 EEPROM, 262144-bit memory density, 90 ns access time. Ideal for industrial applications requiring fast and reliable non-volatile memory storage.

90 ns

R-PDSO-G28

11.8 mm

262144 bit

EEPROM

8

1

28

32768 words

32K

ASYNCHRONOUS

85 Cel

-40 Cel

32KX8

PLASTIC/EPOXY

TSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

5

1.2 mm

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

GULL WING

.55 mm

DUAL

8 mm

10 ms