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QCCJ EEPROM 68

EEPROM
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Command User Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Maximum Write Cycle Time (tWC) Write Protection
AT28C16-20JC by Atmel

AT28C16-20JC

Atmel

Atmel's AT28C16-20JC is a 2Kx8 EEPROM chip with 3-STATE output, operating at 5V. It offers 10000 Write/Erase cycles, 200ns access time, and supports asynchronous mode. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature environments.

200 ns

AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS

NO

YES

10

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

16384 bit

EEPROM

8

2

1

32

2048 words

2K

ASYNCHRONOUS

70 Cel

0 Cel

2KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

PARALLEL

225

5

5

Not Qualified

3.55 mm

.0001 Amp

EEPROMs

30 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

NO

11.43 mm

1 ms

AT28C16-20JI by Atmel

AT28C16-20JI

Atmel

Atmel's AT28C16-20JI is a 2Kx8 EEPROM with 10000 Write/Erase Cycles. Operating at 5V, it offers a max access time of 200ns and features an industrial temperature grade. Widely used in applications requiring non-volatile memory storage, this chip carrier package has a rectangular shape and supports asynchronous operation.

200 ns

AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS

NO

YES

10

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

16384 bit

EEPROM

8

2

1

32

2048 words

2K

ASYNCHRONOUS

85 Cel

-40 Cel

2KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

PARALLEL

225

5

5

Not Qualified

3.55 mm

.0001 Amp

EEPROMs

45 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

NO

11.43 mm

1 ms

AT28LV256-20JC by Atmel

AT28LV256-20JC

Atmel

Atmel's AT28LV256-20JC is a 32Kx8 EEPROM chip with 3.3V supply, 200ns access time, and 10ms write cycle time. Ideal for applications requiring non-volatile memory storage in commercial-grade devices.

200 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

262144 bit

EEPROM

8

2

1

32

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

64

PARALLEL

225

3.3

3

Not Qualified

3.55 mm

.00002 Amp

EEPROMs

15 mA

3.465 V

3.135 V

3.3

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

YES

11.43 mm

10 ms

EPC1064VLC20 by Altera

EPC1064VLC20

Altera

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; JESD-609 Code: e0;

4 WIRE INTERFACE TO FLEX 8000 DEVICES

6 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

1

1

20

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

220

3.3

Not Qualified

4.572 mm

OTP ROMs

3.6 V

3 V

3.3

YES

MOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

8.9662 mm

EPC1064LI20 by Altera

EPC1064LI20

Altera

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 5.5 V;

4 WIRE INTERFACE TO FLEX 8000 DEVICES

4 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

1

1

20

65536 words

64K

SYNCHRONOUS

85 Cel

-40 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

220

5

Not Qualified

4.572 mm

OTP ROMs

5.5 V

4.5 V

5

YES

MOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

8.9662 mm

AT28C256-15JI by Atmel

AT28C256-15JI

Atmel

AT28C256-15JI by Atmel is a 32Kx8 EEPROM chip with 3-STATE output, operating at 5V. It offers industrial-grade temperature range (-40 to 85°C) and supports asynchronous operation. Ideal for applications requiring reliable non-volatile memory storage with fast access times (150ns).

150 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

262144 bit

EEPROM

8

2

1

32

32768 words

32K

ASYNCHRONOUS

85 Cel

-40 Cel

32KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

64

PARALLEL

225

5

5

Not Qualified

MIL-STD-883

3.556 mm

.0002 Amp

EEPROMs

50 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

YES

11.43 mm

10 ms

AT28C256-20JC by Atmel

AT28C256-20JC

Atmel

Atmel's AT28C256-20JC is a 32Kx8 EEPROM chip with 3-STATE output, operating at 5V. It offers 10000 Write/Erase cycles, 200ns access time, and supports asynchronous mode. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.

200 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

262144 bit

EEPROM

8

2

1

32

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

64

PARALLEL

225

5

5

Not Qualified

MIL-STD-883

3.556 mm

.0002 Amp

EEPROMs

50 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

YES

11.43 mm

10 ms

AT28HC256-12JI by Atmel

AT28HC256-12JI

Atmel

AT28HC256-12JI by Atmel is a 32Kx8 EEPROM chip with 3-STATE output, operating at 5V. It features asynchronous mode, industrial temperature grade, and 10000 write/erase cycles endurance. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.

120 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

262144 bit

EEPROM

8

2

1

32

32768 words

32K

ASYNCHRONOUS

85 Cel

-40 Cel

32KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

64

PARALLEL

225

5

5

Not Qualified

MIL-STD-883

3.556 mm

.0003 Amp

EEPROMs

80 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

YES

11.43 mm

10 ms

XC17128ELPC20C by Xilinx

XC17128ELPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

20

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17128ELPC20I by Xilinx

XC17128ELPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

20

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17128EPC20C by Xilinx

XC17128EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Width: 8.9662 mm;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

20

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17128EPC20I by Xilinx

XC17128EPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Pitch: 1.27 mm;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

20

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17256ELPC20I by Xilinx

XC17256ELPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

262144 bit

CONFIGURATION MEMORY

1

3

1

20

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17256EPC20C by Xilinx

XC17256EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

262144 bit

CONFIGURATION MEMORY

1

3

1

20

262144 words

256K

SYNCHRONOUS

70 Cel

0 Cel

256KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17256EPC20I by Xilinx

XC17256EPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Organization: 256KX1;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

262144 bit

CONFIGURATION MEMORY

1

3

1

20

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1736EPC20C by Xilinx

XC1736EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

36288 bit

CONFIGURATION MEMORY

1

3

1

20

36288 words

36288

SYNCHRONOUS

70 Cel

0 Cel

36288X1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1736EPC20I by Xilinx

XC1736EPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Memory Density: 36288 bit;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

36288 bit

CONFIGURATION MEMORY

1

3

1

20

36288 words

36288

SYNCHRONOUS

85 Cel

-40 Cel

36288X1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1765ELPC20C by Xilinx

XC1765ELPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

2.5 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

20

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1765ELPC20I by Xilinx

XC1765ELPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Width: 8.9662 mm;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

2.5 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

20

65536 words

64K

SYNCHRONOUS

85 Cel

-40 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1765EPC20C by Xilinx

XC1765EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Surface Mount: YES;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

20

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1765EPC20I by Xilinx

XC1765EPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

20

65536 words

64K

SYNCHRONOUS

85 Cel

-40 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

AT17LV512-10JC by Atmel

AT17LV512-10JC

Atmel

AT17LV512-10JC by Atmel is a 512KX1 EEPROM chip with synchronous operation, 15 MHz clock frequency, and 524288-bit memory density. It is used in configuration memory applications, operates at 3.3V supply voltage, and has a max temperature of 70°C.

IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO

15 MHz

S-PQCC-J20

e0

8.9662 mm

524288 bit

CONFIGURATION MEMORY

1

2

1

20

524288 words

512K

SYNCHRONOUS

70 Cel

0 Cel

512KX1

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

EEPROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

8.9662 mm

HARDWARE

XC1701PC20C by Xilinx

XC1701PC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Surface Mount: YES;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

1048576 bit

CONFIGURATION MEMORY

1

3

1

20

1048576 words

1M

SYNCHRONOUS

70 Cel

0 Cel

1MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

20 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1701PC20I by Xilinx

XC1701PC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Surface Mount: YES;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

1048576 bit

CONFIGURATION MEMORY

1

3

1

20

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

20 mA

5.5 V

4.5 V

5

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17512LPC20C by Xilinx

XC17512LPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Supply Current: 5 mA;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

524288 bit

CONFIGURATION MEMORY

1

3

1

20

524288 words

512K

SYNCHRONOUS

70 Cel

0 Cel

512KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17512LPC20I by Xilinx

XC17512LPC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Width: 8.9662 mm;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

524288 bit

CONFIGURATION MEMORY

1

3

1

20

524288 words

512K

SYNCHRONOUS

85 Cel

-40 Cel

512KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1702LPC44C by Xilinx

XC1702LPC44C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; No. of Functions: 1;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J44

e0

16.5862 mm

2097152 bit

CONFIGURATION MEMORY

1

3

1

44

2097152 words

2M

SYNCHRONOUS

70 Cel

0 Cel

2MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

16.5862 mm

XC1702LPC44I by Xilinx

XC1702LPC44I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Maximum Supply Current: 10 mA;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J44

e0

16.5862 mm

2097152 bit

CONFIGURATION MEMORY

1

3

1

44

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

16.5862 mm

XC1704LPC44I by Xilinx

XC1704LPC44I

Xilinx

Xilinx XC1704LPC44I is a 3.3V EEPROM with 44 terminals in a square chip carrier package. Operating at -40 to 85°C, it offers 15MHz clock frequency and 4194304-bit memory density for industrial applications requiring configuration memory with synchronous operation.

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J44

e0

16.5862 mm

4194304 bit

CONFIGURATION MEMORY

1

3

1

44

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

16.5862 mm

XC18V01PC20C by Xilinx

XC18V01PC20C

Xilinx

XC18V01PC20C by Xilinx is a 128KX8 EEPROM chip carrier with 33 MHz clock frequency, operating at -40 to 85 °C. It has 20000 write/erase cycles, supports parallel/serial mode, and offers 1048576-bit memory density. Ideal for industrial applications requiring reliable configuration memory with a max standby current of 0.01 Amp.

15 ns

33 MHz

20

20000 Write/Erase Cycles

S-PQCC-J20

e0

8.9662 mm

1048576 bit

CONFIGURATION MEMORY

8

3

1

20

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX8

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

30

NOR TYPE

8.9662 mm

XC18V01PC20I by Xilinx

XC18V01PC20I

Xilinx

Xilinx XC18V01PC20I is a 128Kx8 EEPROM with NOR type technology. Operating at 3.3V, it offers 33MHz clock frequency and 10000 write/erase cycles. Ideal for industrial applications requiring configuration memory with parallel/serial interface and -40 to 85°C temperature range.

15 ns

33 MHz

10

10000 Write/Erase Cycles

S-PQCC-J20

e0

8.9662 mm

1048576 bit

CONFIGURATION MEMORY

8

3

1

20

131072 words

128K

SYNCHRONOUS

85 Cel

-40 Cel

128KX8

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

30

NOR TYPE

8.9662 mm

XC18V02PC44C by Xilinx

XC18V02PC44C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;

20 ns

20 MHz

20

20000 Write/Erase Cycles

S-PQCC-J44

e0

16.5862 mm

2097152 bit

CONFIGURATION MEMORY

8

3

1

44

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

30

NOR TYPE

16.5862 mm

XC18V02PC44I by Xilinx

XC18V02PC44I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: PARALLEL/SERIAL;

20 ns

33 MHz

10

10000 Write/Erase Cycles

S-PQCC-J44

e0

16.5862 mm

2097152 bit

CONFIGURATION MEMORY

8

3

1

44

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

NOR TYPE

16.5862 mm

XC18V04PC44C by Xilinx

XC18V04PC44C

Xilinx

XC18V04PC44C by Xilinx is a 512Kx8 EEPROM with 20 MHz clock frequency, 20000 write/erase cycles, and 3.6V max supply voltage. Ideal for industrial applications requiring NOR type memory with 85°C max operating temp and synchronous operation.

20 ns

20 MHz

20

20000 Write/Erase Cycles

S-PQCC-J44

e0

16.5862 mm

4194304 bit

CONFIGURATION MEMORY

8

3

1

44

524288 words

512K

SYNCHRONOUS

85 Cel

-40 Cel

512KX8

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

30

NOR TYPE

16.5862 mm

XC18V04PC44I by Xilinx

XC18V04PC44I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Surface Mount: YES;

20 ns

33 MHz

10

10000 Write/Erase Cycles

S-PQCC-J44

e0

16.5862 mm

4194304 bit

CONFIGURATION MEMORY

8

3

1

44

524288 words

512K

SYNCHRONOUS

85 Cel

-40 Cel

512KX8

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

NOR TYPE

16.5862 mm

XC18V256PC20C by Xilinx

XC18V256PC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Length: 8.9662 mm;

15 ns

33 MHz

10

10000 Write/Erase Cycles

S-PQCC-J20

e0

8.9662 mm

262144 bit

CONFIGURATION MEMORY

8

3

1

20

32768 words

32K

SYNCHRONOUS

70 Cel

0 Cel

32KX8

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

30

NOR TYPE

8.9662 mm

XC18V256PC20I by Xilinx

XC18V256PC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Finish: Tin/Lead (Sn85Pb15);

15 ns

33 MHz

10

10000 Write/Erase Cycles

S-PQCC-J20

e0

8.9662 mm

262144 bit

CONFIGURATION MEMORY

8

3

1

20

32768 words

32K

SYNCHRONOUS

85 Cel

-40 Cel

32KX8

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

NOR TYPE

8.9662 mm

XC18V512PC20C by Xilinx

XC18V512PC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Seated Height: 4.572 mm;

15 ns

33 MHz

20

20000 Write/Erase Cycles

S-PQCC-J20

e0

8.9662 mm

524288 bit

CONFIGURATION MEMORY

8

3

1

20

65536 words

64K

SYNCHRONOUS

85 Cel

-40 Cel

64KX8

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

30

NOR TYPE

8.9662 mm

XC18V512PC20I by Xilinx

XC18V512PC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Memory Density: 524288 bit;

15 ns

33 MHz

10

10000 Write/Erase Cycles

S-PQCC-J20

e0

8.9662 mm

524288 bit

CONFIGURATION MEMORY

8

3

1

20

65536 words

64K

SYNCHRONOUS

85 Cel

-40 Cel

64KX8

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

2.5/3.3,3.3

Not Qualified

4.572 mm

.01 Amp

Flash Memories

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

TIN LEAD

J BEND

1.27 mm

QUAD

30

NOR TYPE

8.9662 mm

XC17V01PC20C by Xilinx

XC17V01PC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Length: 8.9662 mm;

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

1048576 bit

CONFIGURATION MEMORY

1

3

1

20

1048576 words

1M

SYNCHRONOUS

70 Cel

0 Cel

1MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17V02PC20C by Xilinx

XC17V02PC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Input/Output Type: COMMON;

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

2097152 bit

CONFIGURATION MEMORY

1

3

1

20

2097152 words

2M

SYNCHRONOUS

70 Cel

0 Cel

2MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17V02PC20I by Xilinx

XC17V02PC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

2097152 bit

CONFIGURATION MEMORY

1

3

1

20

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17V04PC20C by Xilinx

XC17V04PC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

4194304 bit

CONFIGURATION MEMORY

1

3

1

20

4194304 words

4M

SYNCHRONOUS

70 Cel

0 Cel

4MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17V04PC20I by Xilinx

XC17V04PC20I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; JESD-609 Code: e0;

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

4194304 bit

CONFIGURATION MEMORY

1

3

1

20

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17V04PC44C by Xilinx

XC17V04PC44C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Maximum Supply Current: 15 mA;

15 MHz

COMMON

S-PQCC-J44

e0

16.5862 mm

4194304 bit

CONFIGURATION MEMORY

1

3

1

44

4194304 words

4M

SYNCHRONOUS

70 Cel

0 Cel

4MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.57 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

16.5862 mm

XC17V04PC44I by Xilinx

XC17V04PC44I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Memory Width: 1;

15 MHz

COMMON

S-PQCC-J44

e0

16.5862 mm

4194304 bit

CONFIGURATION MEMORY

1

3

1

44

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.57 mm

.001 Amp

OTP ROMs

15 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

16.5862 mm

XC17V08PC44C by Xilinx

XC17V08PC44C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Terminal Position: QUAD;

20 MHz

COMMON

S-PQCC-J44

e0

16.5862 mm

8388608 bit

CONFIGURATION MEMORY

8

3

1

44

1048576 words

1M

SYNCHRONOUS

70 Cel

0 Cel

1MX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

3.3

Not Qualified

4.57 mm

.001 Amp

OTP ROMs

100 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

16.5862 mm

XC17V08PC44I by Xilinx

XC17V08PC44I

Xilinx

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

20 MHz

COMMON

S-PQCC-J44

e0

16.5862 mm

8388608 bit

CONFIGURATION MEMORY

8

3

1

44

1048576 words

1M

SYNCHRONOUS

85 Cel

-40 Cel

1MX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

PARALLEL/SERIAL

225

3.3

Not Qualified

4.57 mm

.001 Amp

OTP ROMs

100 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

16.5862 mm