Loading...

SYNCHRONOUS DRAM MODULE DRAM 16

DRAM
Part# Info Specs
Part RoHS Manufacturer Description Access Mode Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Input/Output Type Interleaved Burst Length JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Functions No. of Ports No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Qualification Refresh Cycles Reverse Pinout Screening Level Maximum Seated Height Self Refresh Sequential Burst Length Maximum Standby Current Minimum Standby Voltage Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
MT16LSDF6464HG-13ED2 by Micron Technology

MT16LSDF6464HG-13ED2

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;

5.4 ns

143 MHz

COMMON

R-PDMA-N144

4294967296 bit

SYNCHRONOUS DRAM MODULE

64

144

67108864 words

64M

70 Cel

0 Cel

64MX64

3-STATE

PLASTIC/EPOXY

DIMM

DIMM144,32

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.3

Not Qualified

8192

.032 Amp

DRAMs

4560 mA

3.3

NO

CMOS

COMMERCIAL

NO LEAD

.8 mm

DUAL

MT9LSDT1672G-133G2 by Micron Technology

MT9LSDT1672G-133G2

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Refresh Cycles: 4096; Package Shape: RECTANGULAR;

5.4 ns

133 MHz

COMMON

R-PDMA-N168

1207959552 bit

SYNCHRONOUS DRAM MODULE

72

168

16777216 words

16M

55 Cel

0 Cel

16MX72

3-STATE

PLASTIC/EPOXY

DIMM

DIMM168

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.3

Not Qualified

4096

.018 Amp

DRAMs

2790 mA

3.3

NO

CMOS

COMMERCIAL

NO LEAD

1.27 mm

DUAL

MT8LSDT1664AY-133G3 by Micron Technology

MT8LSDT1664AY-133G3

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Refresh Cycles: 4096; Package Shape: RECTANGULAR;

5.4 ns

133 MHz

COMMON

R-PDMA-N168

1073741824 bit

SYNCHRONOUS DRAM MODULE

64

168

16777216 words

16M

70 Cel

0 Cel

16MX64

3-STATE

PLASTIC/EPOXY

DIMM

DIMM168

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.3

Not Qualified

4096

.016 Amp

DRAMs

2480 mA

3.3

NO

CMOS

COMMERCIAL

NO LEAD

1.27 mm

DUAL

MT16LSDT3264AY-133G3 by Micron Technology

MT16LSDT3264AY-133G3

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Refresh Cycles: 4096; Package Shape: RECTANGULAR;

5.4 ns

133 MHz

COMMON

R-PDMA-N168

2147483648 bit

SYNCHRONOUS DRAM MODULE

64

168

33554432 words

32M

70 Cel

0 Cel

32MX64

3-STATE

PLASTIC/EPOXY

DIMM

DIMM168

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.3

Not Qualified

4096

.032 Amp

DRAMs

4960 mA

3.3

NO

CMOS

COMMERCIAL

NO LEAD

1.27 mm

DUAL

MT18HTS25672RHZ-80EH1 by Micron Technology

MT18HTS25672RHZ-80EH1

Micron Technology

Micron Technology's MT18HTS25672RHZ-80EH1 is a 256MX72 DRAM module with synchronous operation at 400 MHz clock frequency. It features self-refresh capability, operates at 1.8V, and has a memory density of 19.3 Gb. Ideal for applications requiring high-speed data processing in commercial temperature environments.

DUAL BANK PAGE BURST

.4 ns

AUTO/SELF REFRESH; WD-MAX

400 MHz

COMMON

R-XZMA-N200

e3

67.6 mm

19327352832 bit

SYNCHRONOUS DRAM MODULE

72

1

1

1

200

268435456 words

256M

SYNCHRONOUS

70 Cel

0 Cel

256MX72

3-STATE

UNSPECIFIED

DIMM

DIMM200,24

RECTANGULAR

MICROELECTRONIC ASSEMBLY

1.8

Not Qualified

8192

30.15 mm

YES

Other Memory ICs

3123 mA

1.9 V

1.7 V

1.8

NO

CMOS

COMMERCIAL

MATTE TIN

NO LEAD

.6 mm

ZIG-ZAG

3.8 mm

MT16LSDF6464HY-13EG1 by Micron Technology

MT16LSDF6464HY-13EG1

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Length: 67.585 mm;

DUAL BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH; WD-MAX

R-XZMA-N144

e4

67.585 mm

4294967296 bit

SYNCHRONOUS DRAM MODULE

64

1

1

144

67108864 words

64M

SYNCHRONOUS

65 Cel

0 Cel

64MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

31.88 mm

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

Gold (Au)

NO LEAD

.8 mm

ZIG-ZAG

30

3.8 mm

MT16LSDF3264HY-13EG4 by Micron Technology

MT16LSDF3264HY-13EG4

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

DUAL BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH; WD-MAX

R-XZMA-N144

e4

67.585 mm

2147483648 bit

SYNCHRONOUS DRAM MODULE

64

1

1

144

33554432 words

32M

SYNCHRONOUS

65 Cel

0 Cel

32MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

31.88 mm

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

GOLD

NO LEAD

ZIG-ZAG

3.8 mm

MT4LSDT864HG-13EG2 by Micron Technology

MT4LSDT864HG-13EG2

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;

SINGLE BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH; WD-MAX

R-XZMA-N144

e0

67.585 mm

536870912 bit

SYNCHRONOUS DRAM MODULE

64

1

1

144

8388608 words

8M

SYNCHRONOUS

65 Cel

0 Cel

8MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

25.53 mm

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

TIN LEAD

NO LEAD

ZIG-ZAG

3.8 mm

MT4LSDT864HY-133G2 by Micron Technology

MT4LSDT864HY-133G2

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;

SINGLE BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH; WD-MAX

R-XZMA-N144

e4

67.585 mm

536870912 bit

SYNCHRONOUS DRAM MODULE

64

1

1

144

8388608 words

8M

SYNCHRONOUS

65 Cel

0 Cel

8MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

25.53 mm

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

GOLD

NO LEAD

ZIG-ZAG

3.8 mm

MT16LSDT6464AY-13ED2 by Micron Technology

MT16LSDT6464AY-13ED2

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Shape: RECTANGULAR; Terminal Position: DUAL; No. of Words Code: 64M;

DUAL BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH

R-XDMA-N168

e4

4294967296 bit

SYNCHRONOUS DRAM MODULE

64

1

1

168

67108864 words

64M

SYNCHRONOUS

70 Cel

0 Cel

64MX64

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

GOLD

NO LEAD

DUAL

MT16LSDF6464HY-133D2 by Micron Technology

MT16LSDF6464HY-133D2

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

DUAL BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH

R-XZMA-N144

e4

67.585 mm

4294967296 bit

SYNCHRONOUS DRAM MODULE

64

1

1

144

67108864 words

64M

SYNCHRONOUS

65 Cel

0 Cel

64MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

3.8 mm

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

GOLD

NO LEAD

ZIG-ZAG

31.75 mm

MT8LSDT6464HIY-133C1 by Micron Technology

MT8LSDT6464HIY-133C1

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Surface Mount: NO;

DUAL BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH

R-XZMA-N144

e4

67.585 mm

4294967296 bit

SYNCHRONOUS DRAM MODULE

64

1

1

144

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

3.8 mm

YES

3.6 V

3 V

3.3

NO

CMOS

INDUSTRIAL

GOLD

NO LEAD

ZIG-ZAG

31.75 mm

MT36LSDF12872G-133D1 by Micron Technology

MT36LSDF12872G-133D1

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 72;

DUAL BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH

R-XDMA-N168

e0

9663676416 bit

SYNCHRONOUS DRAM MODULE

72

1

1

168

134217728 words

128M

SYNCHRONOUS

70 Cel

0 Cel

128MX72

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

TIN LEAD

NO LEAD

DUAL

MT18LSDT6472G-133D2 by Micron Technology

MT18LSDT6472G-133D2

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Ports: 1;

SINGLE BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH

R-XDMA-N168

e0

4831838208 bit

SYNCHRONOUS DRAM MODULE

72

1

1

168

67108864 words

64M

SYNCHRONOUS

55 Cel

0 Cel

64MX72

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

TIN LEAD

NO LEAD

DUAL

MT16LSDF6464HY-133G1 by Micron Technology

MT16LSDF6464HY-133G1

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Position: ZIG-ZAG;

DUAL BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH; WD-MAX

R-XZMA-N144

67.585 mm

4294967296 bit

SYNCHRONOUS DRAM MODULE

64

1

1

144

67108864 words

64M

SYNCHRONOUS

65 Cel

0 Cel

64MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

31.88 mm

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

NO LEAD

.8 mm

ZIG-ZAG

30

3.8 mm

MT4LSDT1664AY-13ED1 by Micron Technology

MT4LSDT1664AY-13ED1

Micron Technology

SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Package Shape: RECTANGULAR; Access Mode: FOUR BANK PAGE BURST;

FOUR BANK PAGE BURST

5.4 ns

AUTO/SELF REFRESH; WD-MAX

R-XDMA-N168

133.125 mm

1073741824 bit

SYNCHRONOUS DRAM MODULE

64

1

1

168

16777216 words

16M

SYNCHRONOUS

65 Cel

0 Cel

16MX64

UNSPECIFIED

DIMM

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

25.53 mm

YES

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

NO LEAD

1.27 mm

DUAL

NOT SPECIFIED

3.18 mm