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SMF20A-HE3-18

Vishay Intertechnology

SMF20A-HE3-18 by Vishay Intertechnology

Vishay Intertechnology's SMF20A-HE3-18 is a single avalanche diode with 1000W power dissipation, 23.4V breakdown voltage, and 0.1uA reverse current. Ideal for transient suppression in automotive electronics due to AEC-Q101 compliance and unidirectional polarity.

Median Price

$0.285

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 99,980 parts In-Stock

1+ parts

$0.480

100+ parts

$0.189

1k+ parts

$0.121

10k+ parts

$0.083

99,980

$0.480

$0.189

$0.121

$0.083

DigiKey

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.090

50,000

-

-

-

$0.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

-

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 588 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

-

10k+ parts

-

588

$1.010

-

-

-

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

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-

-

Overview

Discover the superior protection offered by Vishay Intertechnology's SMF20A-HE3-18 Transient Suppression Device. This high-quality product provides unmatched reliability and performance in safeguarding your electronic circuits from voltage surges. With a compact design and wide operating temperature range, this device is perfect for various applications where robust transient protection is crucial. Trust Vishay Intertechnology to deliver premium solutions that ensure the longevity and efficiency of your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Config: SINGLE

The single configuration simplifies installation and reduces complexity, making this product a convenient choice for quick and easy setup.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into PCB designs, saving space and allowing for efficient circuit layouts.

Maximum Non Repetitive Peak Reverse Power Dissipation: 1000 W

The high power dissipation capability ensures reliable protection against transient over-voltage events, making this product suitable for high-power applications.

Nominal Breakdown Voltage: 23.4 V

The precise breakdown voltage helps in effectively limiting voltage spikes and protecting sensitive components, making this product a reliable choice for voltage transient suppression.

Maximum Reverse Current: 0.1 uA

The low reverse current ensures minimal power loss and efficient operation, making this product energy-efficient and cost-effective.

Package Shape: RECTANGULAR

The rectangular shape allows for easy handling and placement within a circuit, providing convenience during installation and maintenance.

Reverse Test Voltage: 20 V

The reverse test voltage specification ensures reliable performance under varying voltage conditions, making this product versatile and adaptable to different environments.

No. of Terminals: 2

With two terminals, this product offers simple connectivity and compatibility with standard circuit configurations, making it a versatile choice for diverse applications.

Package Style (Meter): SMALL OUTLINE

The compact small outline package style saves space and allows for efficient board layout, making this product suitable for applications with tight spatial constraints.

Technical Specifications

Transient Suppression Devices SMF20A-HE3-18 attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY, LOW NOISE

Maximum Breakdown Voltage:

24.6 V

Minimum Breakdown Voltage:

22.2 V

Nominal Breakdown Voltage:

23.4 V

Maximum Clamping Voltage:

32.4 V

Config:

SINGLE

Diode Element Material:

SILICON

Maximum Forward Voltage (VF):

2.5 V

JEDEC-95 Code:

DO-219AB

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

1000 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

AEC-Q101; IEC-61000-4-5

Maximum Repetitive Peak Reverse Voltage:

20 V

Maximum Reverse Current:

.1 uA

Reverse Test Voltage:

20 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SMF20A-HE3-18 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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