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SMAJ160AHE3_A/I

Vishay Intertechnology

SMAJ160AHE3_A/I by Vishay Intertechnology

Vishay Intertechnology's SMAJ160AHE3_A/I is a unidirectional Trans Voltage Suppressor Diode with 160V reverse voltage, 300W power dissipation, and 1uA reverse current. It is ideal for transient suppression applications in automotive electronics, meeting AEC-Q101 and UL standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,842 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,842

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Nova Conductors

Japan . 32 parts In-Stock

1+ parts

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100+ parts

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32

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,090 parts In-Stock

1+ parts

$0.010

100+ parts

-

1k+ parts

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10k+ parts

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1,090

$0.010

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Component Stockers USA

USA . 81,768 parts In-Stock

1+ parts

$1.430

100+ parts

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1k+ parts

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10k+ parts

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81,768

$1.430

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AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$16.163

100+ parts

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10k+ parts

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226

$16.163

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Upgrade your electronic devices with the Vishay Intertechnology SMAJ160AHE3_A/I Transient Suppression Device. With a maximum non-repetitive peak reverse power dissipation of 300W, this single-config, surface-mount diode ensures reliable protection against voltage spikes. Ideal for a variety of applications, this diode offers superior quality and performance. Trust Vishay Intertechnology to deliver unmatched value and peace of mind when it comes to safeguarding your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the device, making it a reliable choice for transient suppression applications.

Config: SINGLE

The single configuration simplifies installation and reduces the chances of errors during setup, making this product user-friendly and easy to use.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, saving space and making it suitable for compact electronic devices.

Maximum Non Repetitive Peak Reverse Power Dissipation: 300 W

With a high maximum power dissipation, this device can effectively handle transient surges, ensuring the protection of sensitive components.

Nominal Breakdown Voltage: 187.5 V

The nominal breakdown voltage accurately triggers the suppression mechanism, safeguarding the equipment from voltage spikes above this level.

Maximum Reverse Current: 1 uA

The low maximum reverse current ensures minimal power loss and maintains efficiency during normal operation.

Package Shape: RECTANGULAR

The rectangular package shape offers secure mounting and placement options, enhancing the versatility of this transient suppression device.

Reverse Test Voltage: 160 V

The reverse test voltage specification guarantees reliable performance in diverting excess voltage away from connected devices.

No. of Terminals: 2

With two terminals, this device can easily be connected to external circuits, providing a straightforward solution for transient suppression requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for efficient use of PCB real estate, making it ideal for compact designs.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures the device remains stable and reliable even in demanding environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range enables the device to function effectively in a wide range of environmental conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent conductivity and solderability, ensuring a secure connection for reliable transient suppression.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connection options, accommodating various circuit configurations.

Technical Specifications

Transient Suppression Devices SMAJ160AHE3_A/I attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Maximum Breakdown Voltage:

197 V

Minimum Breakdown Voltage:

178 V

Nominal Breakdown Voltage:

187.5 V

Maximum Clamping Voltage:

259 V

Config:

SINGLE

Diode Element Material:

SILICON

Maximum Forward Voltage (VF):

3.5 V

JEDEC-95 Code:

DO-214AC

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

300 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

3.3 W

Reference Standard:

AEC-Q101; UL RECOGNIZED

Maximum Repetitive Peak Reverse Voltage:

160 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

160 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SMAJ160AHE3_A/I Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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