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SM15T33AHE3_A/H

Vishay Intertechnology

SM15T33AHE3_A/H by Vishay Intertechnology

Vishay Intertechnology's SM15T33AHE3_A/H is a single-configured, surface mount transient suppression device with a max non-repetitive peak reverse power dissipation of 1500W. It is commonly used in applications requiring protection against voltage transients, such as automotive electronics and industrial equipment.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,043 parts In-Stock

1+ parts

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100+ parts

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5,043

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 959 parts In-Stock

1+ parts

$0.178

100+ parts

-

1k+ parts

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10k+ parts

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959

$0.178

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Corohmni

South Africa . 310 parts In-Stock

1+ parts

$0.180

100+ parts

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310

$0.180

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Ampacity Inc.

Singapore . 389 parts In-Stock

1+ parts

$1.010

100+ parts

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389

$1.010

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Semicontronic

India . 630 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

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630

$2.010

$1.960

$1.950

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AZTECH Wire

Italy . 567 parts In-Stock

1+ parts

$14.403

100+ parts

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567

$14.403

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Argo Parts USA

USA . 4,702 parts In-Stock

1+ parts

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4,702

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Continental Prestige Electronics

USA . 1,153 parts In-Stock

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1,153

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Discover the power of high-quality transient suppression devices with the SM15T33AHE3_A/H from Vishay Intertechnology. As a leading manufacturer in the industry, Vishay Intertechnology ensures top-notch performance and reliability. This product is perfect for applications that require protection against voltage transients, offering customers peace of mind and safeguarding their valuable equipment. With its compact size and surface mount capability, the SM15T33AHE3_A/H provides easy installation and compatibility with various devices. Experience the value and benefits of this exceptional product, designed to deliver maximum protection without compromising on efficiency. Trust Vishay Intertechnology to provide superior quality and lasting durability for all your transient suppression needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durable and reliable protection for the transient suppression device, making it an excellent choice for long-lasting performance.

Config: SINGLE

With a single configuration, this device is ideal for applications that require individual transient protection. It simplifies installation and ensures effective suppression of transient voltage.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration of this device onto circuit boards, providing seamless protection against voltage transients.

Maximum Non Repetitive Peak Reverse Power Dissipation: 1500 W

With a high maximum power dissipation rating, this device can handle large transient currents, ensuring reliable performance and protection under demanding conditions.

Nominal Breakdown Voltage: 33.05 V

The nominal breakdown voltage indicates the voltage at which the device starts conducting, effectively suppressing transients to protect sensitive components in the circuit.

Maximum Reverse Current: 1 uA

The low maximum reverse current ensures minimal leakage when the device is not conducting, guaranteeing efficient protection without compromising the overall circuit performance.

Package Shape: RECTANGULAR

The rectangular package shape enables easy integration into various circuit layouts, allowing for flexibility and compatibility with different equipment designs.

Reverse Test Voltage: 28.2 V

The reverse test voltage represents the maximum voltage that can be applied in the opposite direction without damaging the device. This feature ensures robustness and reliable operation.

No. of Terminals: 2

The two-terminal configuration simplifies installation and connection, making the device suitable for various circuit arrangements and enhancing its practicality.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact form factor, saving valuable space on circuit boards and enabling the device's utilization in applications with limited board real estate.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the device to withstand harsh environmental conditions, providing reliable protection in demanding applications.

Minimum Operating Temperature: -65 °C

The low minimum operating temperature range ensures the device's functionality even in extremely cold environments, making it suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish enhances the device's solderability and ensures a secure electrical connection, enabling hassle-free assembly and reliable performance.

Terminal Position: DUAL

The dual terminal position enables versatile mounting options, enhancing the device's adaptability to different circuit layouts and enabling efficient transient suppression.

Maximum Power Dissipation: 6.5 W

The device's high maximum power dissipation capability ensures efficient dissipation of excess energy during transient events, enhancing its performance and longevity.

Minimum Breakdown Voltage: 31.4 V

The minimum breakdown voltage indicates the minimum voltage at which the device starts conducting, providing reliable transient protection for sensitive components in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature specification ensures that the device can withstand the necessary solder reflow processes without any adverse effects, facilitating efficient manufacturing and assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature represents the maximum temperature to which the device can be exposed during solder reflow, ensuring reliable solder joints and overall device performance.

Maximum Breakdown Voltage: 34.7 V

The high maximum breakdown voltage allows for effective suppression of transients with higher voltage levels, extending the device's protection capabilities to a broader range of applications.

Reference Standard: AEC-Q101

Complying with the AEC-Q101 standard ensures that this device meets the stringent automotive industry requirements, making it an ideal choice for automotive applications that demand high reliability and performance.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a trans voltage suppressor diode, this device effectively clamps transient voltages to protect sensitive components from damage, making it a valuable asset in various applications.

Technology: AVALANCHE

Utilizing avalanche technology, this device delivers efficient transient suppression by rapidly diverting excessive energy away from sensitive components, ensuring reliable circuit protection.

Terminal Form: C BEND

The C bend terminal form facilitates secure and reliable solder joint connections, ensuring proper electrical contact, ease of handling, and efficient assembly.

No. of Elements: 1

With a single element, this device simplifies circuit design and integration, offering a straightforward solution for effective transient suppression.

Maximum Repetitive Peak Reverse Voltage: 28.2 V

The device's high maximum repetitive peak reverse voltage enables excellent protection against repeated transient events, ensuring long-term reliability and safeguarding sensitive components.

Moisture Sensitivity Level (MSL): 1

Rated with MSL 1, this device exhibits excellent moisture resistance, allowing for safe and reliable operation even in humid environments.

Polarity: UNIDIRECTIONAL

With unidirectional polarity, this device effectively clamps voltage transients in one direction, providing targeted protection for sensitive components in the circuit.

Maximum Clamping Voltage: 45.7 V

The high maximum clamping voltage specification indicates the voltage level at which the device limits transient voltages, offering robust protection for sensitive components.

Diode Element Material: SILICON

Utilizing silicon as the diode element material, this device provides efficient transient suppression capabilities, ensuring reliable operation and protecting the circuit from voltage surges.

Technical Specifications

Transient Suppression Devices SM15T33AHE3_A/H attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Maximum Breakdown Voltage:

34.7 V

Minimum Breakdown Voltage:

31.4 V

Nominal Breakdown Voltage:

33.05 V

Maximum Clamping Voltage:

45.7 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AB

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

1500 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

6.5 W

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

28.2 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

28.2 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SM15T33AHE3_A/H Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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