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SM15T30CAHE3_A/I

Vishay Intertechnology

SM15T30CAHE3_A/I by Vishay Intertechnology

Vishay Intertechnology's SM15T30CAHE3_A/I is a single-configured, surface mount transient suppression device with a max non-repetitive peak reverse power dissipation of 1500 W. It has a breakdown voltage of 30 V and is commonly used in automotive applications due to its AEC-Q101 reference standard and bidirectional polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,521 parts In-Stock

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7,521

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 660 parts In-Stock

1+ parts

$1.010

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660

$1.010

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AZTECH Wire

Italy . 506 parts In-Stock

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$10.272

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506

$10.272

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Continental Prestige Electronics

USA . 2,877 parts In-Stock

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2,877

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Argo Parts USA

USA . 1,356 parts In-Stock

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1,356

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the SM15T30CAHE3_A/I by Vishay Intertechnology, a high-quality Transient Suppression Device designed to provide exceptional protection for your electronic devices. Manufactured by Vishay Intertechnology, a trusted name in the industry, this product offers numerous advantages and benefits. With its compact design and surface mount capabilities, it is easy to use and install. The SM15T30CAHE3_A/I boasts a maximum non-repetitive peak reverse power dissipation of 1500W, ensuring reliable performance even in demanding conditions. Its bidirectional polarity and avalanche technology make it suitable for a wide range of applications. Trust the SM15T30CAHE3_A/I to safeguard your valuable equipment and enjoy peace of mind knowing that you have chosen a top-of-the-line product from Vishay Intertechnology.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY. This material provides durability and protection for the device, making it suitable for various applications.

Config

SINGLE. This configuration allows for easy installation and integration into existing systems.

Surface Mount

YES. The surface mount capability enables seamless and efficient PCB assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation

1500 W. With a high power dissipation capability, this device can handle large surges and transients, thereby ensuring reliable and robust protection.

Nominal Breakdown Voltage

30 V. The nominal breakdown voltage specification indicates the voltage level at which the device starts conducting, safeguarding sensitive components from excessive voltage spikes.

Maximum Reverse Current

1 uA. The remarkably low reverse current ensures minimal power loss during normal operating conditions.

Package Shape

RECTANGULAR. The rectangular package shape facilitates straightforward and space-saving integration into various circuit designs.

Reverse Test Voltage

25.6 V. This reverse test voltage specification demonstrates the device's ability to withstand and block voltage in the reverse direction.

No. of Terminals

2. With just two terminals, this device is simple to connect and incorporate into electronic systems.

Package Style (Meter)

SMALL OUTLINE. The small outline package style offers compatibility with miniature and compact designs, perfect for applications with limited space.

Maximum Operating Temperature

150 °C. With a high maximum operating temperature, this device can effectively handle thermal challenges in demanding environments.

Minimum Operating Temperature

65 °C. The ability to operate at extremely low temperatures makes this device suitable for a wide range of applications that require operation in harsh and cold conditions.

Terminal Finish

Matte Tin (Sn). The matte tin terminal finish enhances solderability and ensures reliable electrical connections during assembly.

Terminal Position

DUAL. The dual terminal position provides flexibility and ease of installation, accommodating various circuit layouts.

Maximum Power Dissipation

6.5 W. This device's ability to handle high power dissipation enables effective suppression of large transient events.

Minimum Breakdown Voltage

28.5 V. The high minimum breakdown voltage ensures prompt protection against voltage surges, preventing damage to sensitive components.

Maximum Time At Peak Reflow Temperature (s)

30. The maximum time at peak reflow temperature specification outlines the device's thermal stability during manufacturing processes, ensuring consistent performance and quality.

Peak Reflow Temperature °C

260. The high peak reflow temperature indicates the device's capability to withstand the high temperatures associated with soldering processes.

Maximum Breakdown Voltage

31.5 V. The high maximum breakdown voltage offers an ample voltage headroom, enhancing the device's protection capability.

Reference Standard

AEC-Q101. Complying with the AEC-Q101 standard ensures the quality and reliability of this device, making it suitable for automotive applications.

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE. This diode type is specifically designed to clamp and suppress voltage transients, guaranteeing excellent surge protection.

Technology

AVALANCHE. The avalanche technology employed in this device enables it to handle high power surges without compromising its performance and reliability.

Terminal Form

C BEND. The C bend terminal form simplifies the device's installation and provides a secure connection to PCBs or other electronic components.

Maximum Repetitive Peak Reverse Voltage

25.6 V. This specification indicates the device's capability to withstand repetitive voltage transients, ensuring long-term performance and reliability.

Polarity

BIDIRECTIONAL. With bidirectional polarity, this device can protect against voltage surges in both forward and reverse directions.

Maximum Clamping Voltage

41.5 V. The high maximum clamping voltage ensures efficient voltage suppression, preventing the downstream components from being exposed to damaging voltage levels.

Diode Element Material

SILICON. The silicon diode element material guarantees stable and reliable performance over a wide range of temperatures and operating conditions.

Technical Specifications

Transient Suppression Devices SM15T30CAHE3_A/I attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Maximum Breakdown Voltage:

31.5 V

Minimum Breakdown Voltage:

28.5 V

Nominal Breakdown Voltage:

30 V

Maximum Clamping Voltage:

41.5 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AB

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

1500 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

6.5 W

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

25.6 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

25.6 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SM15T30CAHE3_A/I Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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