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ORNTA25-1T1

Vishay Intertechnology

ORNTA25-1T1 by Vishay Intertechnology

Vishay Intertechnology's ORNTA25-1T1 is a thin film resistor network with 4 functions, 8 terminals, and 5 ppm/°C temperature coefficient tracking. It has a 0.1 W power dissipation, -55 to 150 °C operating temperature range, and is ideal for divider applications in surface mount setups.

Median Price

$2.943

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.943

100+ parts

-

1k+ parts

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10k+ parts

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200

$2.943

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Vyrian

USA . 4,890 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,890

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 389 parts In-Stock

1+ parts

$0.451

100+ parts

-

1k+ parts

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389

$0.451

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$2.943

100+ parts

$2.796

1k+ parts

$2.656

10k+ parts

$2.619

300

$2.943

$2.796

$2.656

$2.619

AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$11.926

100+ parts

-

1k+ parts

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304

$11.926

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QUARKTWIN TECHNOLOGY LTD

USA . 20,412 parts In-Stock

1+ parts

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20,412

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Overview

Looking to enhance your electronic circuits? The ORNTA25-1T1 resistor network by Vishay Intertechnology is the perfect solution for your design needs. With a thin film technology and high precision tolerance of 0.1%, this rectangular package resistor array offers superior performance and reliability. Ideal for divider applications, this product boasts a temperature coefficient tracking of 5ppm/°C, ensuring stable operation even in extreme conditions. Upgrade your projects with Vishay's quality components and experience unmatched value and efficiency.

Feature Benefit Bullets

Element Power Dissipation: 0.1 W

Low power dissipation ensures efficient operation and prevents overheating.

Rated Temperature: 70 °C

Suitable for a wide range of operating temperatures.

No. of Functions: 4

Offers versatility in circuit design with multiple functions in one component.

Technology: THIN FILM

Thin film technology provides high precision and stability in resistance values.

Shape (Package): RECTANGULAR PACKAGE

Rectangular shape allows for easy integration into circuit boards.

Construction: Molded Case

Molded case construction ensures durability and protection of components.

Packing Method: TR, EMBOSSED, 13 INCH

Embossed packing ensures secure handling and storage during transportation.

Network Type: DIVIDER

Divider network type enables precise voltage division in circuits.

No. of Terminals: 8

Sufficient terminals for connections in complex circuit configurations.

Temperature Coef Tracking: 5 ppm/°C

Low temperature coefficient tracking ensures stable performance over a wide temperature range.

Package Style (Meter): DIP

Dual in-line package style allows for easy placement and soldering on circuit boards.

Terminal Shape: GULL WING

Gull wing terminal shape provides secure soldering and connection stability.

Maximum Operating Temperature: 150 °C

High maximum operating temperature for reliable performance in harsh environments.

First Element Resistance: 25000 ohm

High resistance value for precision applications and voltage division.

Minimum Operating Temperature: -55 °C

Wide range of minimum operating temperature for versatility in usage.

Temperature Coef (ppm/°C): 25

Low temperature coefficient ensures stable resistance values with temperature changes.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability.

Second or Last Element Resistance: 1000 ohm

Low resistance value for voltage division and circuit balancing.

Height (Package): 1.73 mm

Low profile package height for compact circuit board design.

Resistor Type: ARRAY/NETWORK RESISTOR

Specifically designed for network applications requiring multiple resistors in one package.

Operating Voltage: 100 V

High operating voltage capability for a wide range of circuit applications.

Tolerance: 0.1 %

High precision tolerance for accurate resistance values.

Length (Package): 3.9 mm

Compact package length for space-saving on circuit boards.

Mounting Type: SURFACE MOUNT

Surface mounting type for easy and secure installation on PCBs.

Rated Power Dissipation (P): 0.4 W

Higher rated power dissipation for potential increased performance in demanding applications.

Width (Package): 4.9 mm

Compact width for efficient use of space on circuit boards.

Technical Specifications

Resistor Networks & Arrays ORNTA25-1T1 attributes and parameters. Explore more Resistor Networks & Arrays devices from Vishay Intertechnology

Specs

Construction:

Molded Case

Element Power Dissipation:

.1 W

First Element Resistance:

25000 ohm

JESD-609 Code:

e3

Mounting Type:

Network Type:

DIVIDER

No. of Elements:

1

No. of Functions:

4

No. of Terminals:

8

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

1.73 mm

Length (Package):

3.9 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

DIP

Width (Package):

4.9 mm

Packing Method:

TR, EMBOSSED, 13 INCH

Rated Power Dissipation (P):

Rated Temperature:

70 Cel

Resistor Type:

Second or Last Element Resistance:

1000 ohm

Size Code:

1519

Sub-Category:

Array/Network Resistors

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Temperature Coef Tracking:

5 ppm/Cel

Terminal Finish:

MATTE TIN

Terminal Shape:

GULL WING

Tolerance:

Operating Voltage:

100 V

Trade Compliance

ORNTA25-1T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.10

SB

8533.21.00.25

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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