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ISC1812RV561J

Vishay Intertechnology

ISC1812RV561J by Vishay Intertechnology

GENERAL PURPOSE INDUCTOR; Package Style (Meter): SMT; Minimum Operating Temperature: -55 Cel; Manufacturer Series: ISC-1812; Construction: Molded Chip; Package Height: 3.2 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 83,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

83,801

-

-

-

-

Technical Specifications

Fixed Inductors ISC1812RV561J attributes and parameters. Explore more Fixed Inductors devices from Vishay Intertechnology

Inductor Specifications

Inductor Type:

Nominal Inductance:

560 μH

Maximum Rated Current:

82 mA

Minimum Quality Factor (at L-nom):

30

DC Resistance:

10.5 Ω

Tolerance:

5 %

Self Resonance Frequency:

2.8 MHz

Manufacturer Series:

ISC-1812

Series:

ISC-1812

Physical Characteristics

Case or Size Code:

1812

Construction:

Molded Chip

Core Material:

Ferrite

Thermal Characteristics

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Packaging & Delivery

Package Style:

SMT

Package Length:

0.177 in (4.5 mm)

Package Height:

0.126 in (3.2 mm)

Package Width:

0.126 in (3.2 mm)

Packing Method:

Tape and Reel, 7 in

Trade Compliance

ISC1812RV561J Inductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

Category top products 20

Authentic purchasing experiences

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