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FC0402E50R0BTBWS

Vishay Intertechnology

FC0402E50R0BTBWS by Vishay Intertechnology

Vishay Intertechnology's FC0402E50R0BTBWS is a thin film chip resistor with 50 ohm resistance, 0.1% tolerance, and 0.05 W power dissipation. Ideal for SMT applications in electronics requiring precise resistance values within -55 to 125 °C temperature range.

Median Price

$1.341

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$1.341

100+ parts

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1k+ parts

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650

$1.341

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Vyrian

USA . 393 parts In-Stock

1+ parts

-

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1k+ parts

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393

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 497 parts In-Stock

1+ parts

$0.064

100+ parts

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497

$0.064

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Aztec Data Supply Inc.

USA . 1,634 parts In-Stock

1+ parts

$0.220

100+ parts

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1,634

$0.220

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Continental Prestige Electronics

USA . 3,278 parts In-Stock

1+ parts

$1.341

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$1.314

3,278

$1.341

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$1.314

Argo Parts USA

USA . 2,790 parts In-Stock

1+ parts

$1.341

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2,790

$1.341

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AZTECH Wire

Italy . 356 parts In-Stock

1+ parts

$13.762

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356

$13.762

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Overview

Vishay Thin Film FC High-Frequency RF Resistors feature six case sizes designed with edge-trimmed blocks and a high-purity alumina substrate. The resistors offer a less than 10mΩ internal reactance and function within a 40GHz max frequency range. The Vishay Thin Film FC High-Frequency RF Resistors are made with a passivated nichrome material and optional epoxy bondable terminations. The resistors operate in a 30V to 75V voltage range, a 50mW to 330mW power rating range, and a -55°C to +155°C temperature range. The FC series produces less than -35dB noise, which makes the resistors ideal for low-noise amplifiers, attenuation, and line termination applications.

Feature Benefit Bullets

Technology THIN FILM

Thin film technology ensures high precision and stability in resistance, making this resistor suitable for applications requiring accuracy.

Construction Chip

Chip construction allows for compact and space-saving design, ideal for modern electronics where space is limited.

Packing Method Waffle Pack

Waffle pack packing method ensures secure and organized handling during shipping and storage, reducing the risk of damage.

Resistance 50 ohm

With a resistance value of 50 ohms, this resistor is suitable for specific applications requiring this resistance level.

No. of Terminals 2

Having two terminals simplifies the connection process and allows for easy integration into circuits.

Package Style (Meter) SMT

Surface-mount technology package style enables easy and efficient assembly on circuit boards, improving manufacturing efficiency.

Maximum Operating Temperature 125 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature -55 °C

Low minimum operating temperature allows for a wide range of operating environments, from cold to hot conditions.

Temperature Coef (ppm/°C) 25

Low temperature coefficient of 25 ppm/°C ensures minimal resistance drift over a wide temperature range, maintaining accuracy.

Terminal Finish Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier

Terminal finish with Tin/Lead coating and Nickel barrier provides excellent solderability and ensures long-term reliability in connections.

Height (Package) 0.381 mm

Low package height of 0.381 mm allows for slim and compact design, suitable for space-constrained applications.

Resistor Type FIXED RESISTOR

Being a fixed resistor, this product offers a stable resistance value without the need for adjustment, ensuring consistent performance.

Operating Voltage 30 V

With an operating voltage of 30V, this resistor is suitable for applications requiring voltages within this range.

Tolerance 0.1 %

High tolerance of 0.1% ensures precise and accurate resistance values, making this resistor suitable for precision applications.

Length (Package) 1.067 mm

Compact package length of 1.067 mm allows for efficient use of space on circuit boards, contributing to a clean and organized layout.

Rated Power Dissipation (P) 0.05 W

With a rated power dissipation of 0.05W, this resistor can handle power without overheating, ensuring long-term reliability.

Width (Package) 0.559 mm

Package width of 0.559 mm allows for a slim profile, making it suitable for applications where space is limited.

Technical Specifications

Fixed Resistors FC0402E50R0BTBWS attributes and parameters. Explore more Fixed Resistors devices from Vishay Intertechnology

Specs

Construction:

Chip

JESD-609 Code:

e0

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.381 mm

Length (Package):

1.067 mm

Package Style (Meter):

SMT

Width (Package):

.559 mm

Packing Method:

Waffle Pack

Rated Power Dissipation (P):

Resistance:

Resistor Type:

Size Code:

0402

Sub-Category:

Fixed Resistors

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Terminal Finish:

Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier

Tolerance:

Operating Voltage:

30 V

Trade Compliance

FC0402E50R0BTBWS Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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