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BAS85

Vishay Intertechnology

BAS85 by Vishay Intertechnology

Vishay Intertechnology's BAS85 is a Schottky rectifier diode with a max forward voltage of 0.8V and output current of 0.2A. With a fast reverse recovery time of 0.005us, it is ideal for applications requiring high-speed switching in electronics such as power supplies and voltage clamping circuits.

Median Price

$0.041

Lifecycle Status

Suppliers In-Stock

66

In-Stock Inventory

1k+

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DigiKey

USA . 4,649 parts In-Stock

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Distrelec

Netherlands . 700 parts In-Stock

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NAC Semi

USA . 65,000 parts In-Stock

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Freelance Electronics

USA . 4,395 parts In-Stock

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Maritex

Poland . 615 parts In-Stock

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DF Sales Co.

USA . 12,000 parts In-Stock

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DF Sales Co.

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Bristol Electronics

USA . 71,356 parts In-Stock

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Digiode

USA . 4,893 parts In-Stock

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Component Electronics Inc.

Canada . 2,300 parts In-Stock

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TEDSS.com

USA . 3,345 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

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Partservice

France . 135,160 parts In-Stock

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Micros

Poland . 73,680 parts In-Stock

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Dan-Mar Components

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First Choice Components Inc.

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Bas Electronics GmbH & Co. KG

Germany . 53 parts In-Stock

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Ukraine . 10 parts In-Stock

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Corohmni

South Africa . 748 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,846 parts In-Stock

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Semicontronic

India . 4,359 parts In-Stock

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Corphita

USA . 1,955 parts In-Stock

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AZTECH Wire

Italy . 8,990 parts In-Stock

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RC Electronics

USA . 146,856 parts In-Stock

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Overview

Enhance your electronic projects with the BAS85 by Vishay Intertechnology. This high-quality rectifier diode offers quick reverse recovery time and a maximum forward voltage of 0.8V, making it ideal for applications requiring efficient power conversion. With Vishay's reputation for excellence in diodes and rectifiers, you can trust that the BAS85 delivers reliable performance. Whether you're designing circuits for consumer electronics, automotive systems, or industrial equipment, this Schottky diode provides the value, benefits, and advantages you need to succeed. Upgrade your designs today with the BAS85!

Feature Benefit Bullets

Package Body Material: GLASS

The use of glass as the package body material ensures durability and high temperature tolerance, making this product a reliable choice.

Config: SINGLE

The single configuration simplifies the design and installation process, making it ideal for straightforward applications.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on printed circuit boards, making it convenient and efficient.

Maximum Reverse Recovery Time: 0.005 us

The extremely fast reverse recovery time ensures minimal power loss and high efficiency in switching applications.

Package Shape: ROUND

The round package shape provides a compact and space-saving design for efficient PCB layout and assembly.

No. of Terminals: 2

The two terminals provide a straightforward connection setup, making it user-friendly and easy to integrate into circuits.

Package Style (Meter): LONG FORM

The long form package style provides a larger surface area for heat dissipation, ensuring optimal performance in high temperature environments.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can withstand harsh conditions and maintain stable performance.

Terminal Finish: Tin/Silver (Sn97.5Ag2.5)

The tin/silver terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

Terminal Position: END

The end terminal position simplifies installation and facilitates easy connection to external components, making it convenient for users.

Case Connection: ISOLATED

The isolated case connection provides enhanced safety and protection against electrical faults, making it a secure choice for sensitive applications.

Maximum Power Dissipation: 0.2 W

The low power dissipation ensures efficient operation and reduced heat generation, increasing the longevity of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes the risk of thermal damage during installation, ensuring reliable performance after soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for secure soldering and reliable connections in demanding environments.

Diode Type: RECTIFIER DIODE

The rectifier diode design ensures efficient conversion of AC to DC power, making it suitable for various electronic applications.

Maximum Forward Voltage (VF): 0.8 V

The low forward voltage drop minimizes power loss and improves efficiency in voltage conversion applications.

Maximum Output Current: 0.2 A

The high output current rating allows for reliable performance in various power supply and switching applications.

Technology: SCHOTTKY

The Schottky technology provides low forward voltage drop and fast switching speeds, making it ideal for high frequency applications.

Terminal Form: WRAP AROUND

The wrap-around terminal form provides secure connections and enhances mechanical strength, ensuring long-term reliability in operation.

Maximum Repetitive Peak Reverse Voltage: 30 V

The high peak reverse voltage rating ensures protection against voltage spikes and reverse currents, making it suitable for demanding electrical environments.

Maximum Non Repetitive Peak Forward Current: 5 A

The high peak forward current capability allows for reliable performance in high current applications, ensuring safe and efficient operation.

Diode Element Material: SILICON

The use of silicon as the diode element material provides high performance and reliability, making it a durable and efficient choice for electronic circuits.

Technical Specifications

Diodes & Rectifiers BAS85 attributes and parameters. Explore more Diodes & Rectifiers devices from Vishay Intertechnology

Specs

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.8 V

JESD-30 Code:

O-LELF-R2

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

5 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Maximum Output Current:

.2 A

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.2 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30 V

Maximum Reverse Recovery Time:

.005 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

Tin/Silver (Sn97.5Ag2.5)

Terminal Form:

Terminal Position:

END

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BAS85 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

NSN

5961-01-448-9046, 5961014489046, 5961-01-610-8796, 5961016108796

NIIN

014489046, 016108796

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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