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AC050000B4309J6BCS

Vishay Intertechnology

AC050000B4309J6BCS by Vishay Intertechnology

FUSIBLE RESISTOR; Mounting Type: THROUGH HOLE MOUNT; Resistance: 43 ohm; Rated Power Dissipation (P): 5 W; Maximum Operating Temperature: 200 Cel; Tolerance: 5 %;

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 98,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98,320

-

-

-

-

Technical Specifications

Fusible Resistors AC050000B4309J6BCS attributes and parameters. Explore more Fusible Resistors devices from Vishay Intertechnology

Specs

Construction:

Tubular

JESD-609 Code:

e3

Diameter (Lead):

.8 mm

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-40 Cel

Diameter (Package):

10 mm

Length (Package):

17 mm

Package Style (Meter):

Axial

Packing Method:

AMMO PACK

Rated Power Dissipation (P):

5 W

Rated Temperature:

40 Cel

Reference Standard:

UL

Resistance:

Resistor Type:

Technology:

WIRE WOUND

Temperature Coef (ppm/Cel):

200

Terminal Finish:

Matte Tin (Sn)

Terminal Shape:

WIRE

Tolerance:

5 %

Operating Voltage:

14.6629 V

Trade Compliance

AC050000B4309J6BCS Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

Category top products 20

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